Electronics Forum | Mon Jan 21 06:58:41 EST 2019 | kiransahu
Without PCB layout, not much would get done. It is a ubiquitous need across industries; Industrial, consumer, military...Everywhere you look, there are chips soldered to PCBs to create a final product for the end customer. But where did we all learn
Electronics Forum | Mon Dec 12 09:41:57 EST 2022 | poly
Thanks Peter, when I open feeder teach i'm presented with a bunch of actions. I can't find docs on what the different actions are. Do you know which one I should do? I have attempted to teach the corners but the value it gives put the PTF pick point
Industry News | 2013-08-27 13:14:25.0
Baja Bid, a leading host for online SMT exchange auction events, is kicking off another sale of used SMT, assembly, and remanufactured SMT equipment.
Industry News | 2013-08-22 12:55:43.0
A leading auction agency has announced it will be hosting an online exchange auction of used equipment utilized in the electronics manufacturing industry. The auction opens on Tuesday, August 27, 2013 at 8:00am EST and begins closing on Thursday, August 29, 2013 at 11:00am EST.
Technical Library | 2022-07-11 09:24:48.0
The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.
Technical Library | 2013-07-25 14:02:15.0
Bottom-termination components (BTC), such as QFNs, are becoming more common in PCB assemblies. These components are characterized by hidden solder joints. How are defects on hidden DFN joints detected? Certainly, insufficient solder joints on BTCs cannot be detected by manual visual inspection. Nor can this type of defect be detected by automated optical inspection; the joint is hidden by the component body. Defects such as insufficients are often referred to as "marginal" defects because there is likely enough solder present to make contact between the termination on the bottom-side of the component and the board pad for the component to pass in-circuit and functional test. Should the board be subjected to shock or vibration, however, there is a good chance this solder connection will fracture, leading to an open connection.
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