Electronics Forum | Mon Jul 04 14:21:14 EDT 2011 | davef
The three primary causes for bubble generation in solvent-based coatings are: * Air entrapment * Solvent flash-off * Curing the coating too quickly Tell us more about your process including: * When you first notice the bubbles * Extent of the probl
Electronics Forum | Mon Dec 19 07:55:30 EST 2016 | bk
I am assuming that these are the round aluminum electrolytic caps. The problem may be that they are too wide to put on 2 hydra heads next to each other. Plus the hydra heads are not that great at placing tall parts. I would not let the hydra place th
Industry News | 2003-05-14 08:14:21.0
One of the UK's leading manufacturers of printed circuit boards has appointed an experienced industry professional as its new Technical Sales Manager.
Industry News | 2010-10-16 19:14:57.0
SMTnet.com, a developer and provider of community based internet marketing platforms will present a technical session, “Electronics Manufacturing Marketing - A Paradigm Shift.”
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Parts & Supplies | Pick and Place/Feeders
How to register a Juki customized nozzle on your KE1070L Pick and Place machine A few weeks ago, one Argentina Customer told me that the have a component MPX6400, their JUKI KE1070L regular nozzles can't pick up it, whether we could make custom
Technical Library | 2024-03-20 13:37:18.0
Effective and reliable dispensing is based primarily on process technology that has been perfectly set up for the specific project. Anyone tasked with planning dispensing systems and responsible for the processes should know the principles and key factors involved so that the dispensing processes can be successfully implemented in cooperation with system and material partners. This White Paper explains the relevant aspects of process technology and provides valuable practical tips.
Technical Library | 2019-09-04 21:35:53.0
Since the European Directives, RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization and Restriction of Chemicals), entered into force in 2006-7, the number of regulated substances continues to grow. REACH adds new substances roughly twice a year, and more substances will be added to RoHS in 2019. While these open-ended regulations represent an ongoing burden for supply chain reporting, some ability to remain ahead of new substance restrictions can be achieved through full material declarations (FMD) specifically the IPC-1752A Class D Standard (the "Standard"), which was developed by the IPC - Association Connecting Electronic Industries. What is important to the supply chain is access to user-friendly, easily accessible or free, fully supported tools that allow suppliers to create and modify XML (Extensible Markup Language) files as specified in the Standard. Some tools will provide enhancements that validate required data entry and provide real-time interactive messages to facilitate the resolution of errors. In addition, validation and auto-population of substance CAS (Chemical Abstract Service) numbers, and Class D weight rollup validation ensure greater success in the acceptance of the declarations in customer systems that automate data gathering and reporting. A good tool should support importing existing IPC-1752A files for editing; this capability reduces the effort to update older declarations and greatly benefits suppliers of a family of products with similar composition. One of the problems with FMDs is the use of "wildcard" non-CAS numbers based on a declarable substance list (DSL). While the substances in different company's lists tend to have some overlap, no two DSL’s are the same. We provide an understanding of the commonality and differences between representative DSLs, and the ability to configure how much of a non-DSL substance percent is allowed. Case studies are discussed to show how supplier compliance data, can be automatically loaded into the customer's enterprise compliance system. Finally, we briefly discuss future enhancements and other developments like Once an Article, Always an Article (O5A) that will continue to require IPC standards and supporting tools to evolve.
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
Controlling system control machine working path and mixing time , mix ratio and gluing amount . Mixing system mix glue and convey glue to dispensing head according to the instructions of machine controlling system. Three axis platform the working pat
Events Calendar | Tue May 15 00:00:00 EDT 2018 - Tue May 15 00:00:00 EDT 2018 | ,
Parts and Assembly Storage Life: How to Determine and Manage
GPD Global | https://www.gpd-global.com/pdf/doc/FLOware-Base-Locations-Reference-Guide-22100025.pdf
backup is complete, select the desired base location from the Check/Set Base Locations window. For details on how to open the proper windows and select a location, refer to Step Teaching Base Locations (pg 2). 3. With the desired base location selected
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>> SMT Technical How To Set Profile In SMT Reflow Oven One - Profile’s importance in reflow soldering Reflow soldering is a main method to form solder joints on SMT base-panels and so is a core technology in SMT process
