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PCBA CLEANING MACHINE 5600 PCBA CLEANING MACHINE SMT CLEANING MACHINE Demensions:600 x 1000 x 1600mm PCB width:50-400mm PCB Length:Max 460mm Pitches:10,20,30mm Product description: PCBA CLEANING MACHINE 5600 INQUIRY PCBA CLEANING MAC
Electronics Forum | Mon May 06 11:45:32 EDT 2019 | slthomas
There are quite a few papers out there on the subject. Just enter "SMT void reduction" into google or other search engine and take your pick. That said, slow ramp rates and paste volume reduction are a good place to start. Although I haven't tried i
Electronics Forum | Thu Dec 07 19:20:28 EST 2006 | ganoi
Most likely there is movement during reflow. How about conduction oven over convection oven for reflow? This is a small PCB with the LED sitting on a Flex-Rigid extension from the PCB. I was thinking if the stencil aperature for the LED was to be cu
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2012-02-23 15:41:59.0
Following a year of successful product launches, MYDATA continues its drive to accelerate the success of electronics manufacturers worldwide. At the IPC APEX Expo show (Booth #3429) the company will show visitors how to Agilify their production with faster, smarter and more agile assembly solutions. Highlights include the new High Speed Synergy line rated at 90,000 cph, a highly advanced solution that enables any assembly environment to handle both prototyping and volume production - all within a single production line.
This animation shows the overview of programming and running of a MYDATA MY500 Jet Printing machine. Check the ''Jet Printing in detail'' video to see how Jet Printing works
Events Calendar | Wed May 04 00:00:00 EDT 2022 - Wed May 04 00:00:00 EDT 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Prototyping Your New Electronic Product Idea News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Prototyping Your New Electronic Product Idea Innovative Circuits, Inc. Jim
SMTnet Express, April 7, 2022, Subscribers: 25,732, Companies: 11,564, Users: 27,174 Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal characteristics and mechanical properties of a
ASCEN Technology | https://www.ascen.ltd/optical_inspection/1075.html
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