Click here to view the SlimKIC 2000 datasheet Profiling So Easy, Anyone Can Do It By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select fro
Click here to view the SlimKIC 2000 datasheet Profiling So Easy, Anyone Can Do It By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select fro
Electronics Forum | Mon May 27 04:28:30 EDT 2019 | SMTA-Rogers
Dear Steve, Thanks for your feedback in our experience add solder paste volume is better for the voids reduce of LED type components.
Electronics Forum | Tue May 07 10:13:06 EDT 2019 | cyber_wolf
I have personally never seen a reflow profile change reduce voids. We have invited "experts" in to demonstrate this claim. They were unable to.
Industry News | 2018-10-18 10:04:27.0
How to Decrease PCB Fabrication and Assembly Costs While Maintaining High Quality
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
PCB magazine unloader/Multi magazine unloader how to receive the PCB after soldering, more detail check :https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/91.html Multi Magazine PCB unloader is used at the end of the SMT line for unlo
PCB magazine unloader/Multi magazine unloader how to receive the PCB after soldering, more detail check :https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/91.html Multi Magazine PCB unloader is used at the end of the SMT line for unlo
Events Calendar | Wed May 04 00:00:00 EDT 2022 - Wed May 04 00:00:00 EDT 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
5 Common Solder Mistakes and How to Resolve Them Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena
Imagineering, Inc. | https://www.pcbnet.com/blog/causes-of-pcb-warping-how-to-prevent-it/
Causes of PCB Warping & How to Prevent It | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
