New Equipment | Rework & Repair Equipment
Full automatic BGA rework station WDS-750 all motherboard repair machine for iphone PS4 repairing WDS BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main u
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Sole manufacturer WDS-700 automatic mobile phone BGA rework station for iphone / samsung /HTC motherboard wi
Electronics Forum | Mon Jul 04 20:10:05 EDT 2011 | rickysanchez
1.The bubbles appear only after the oven curing.before curing no bubbles encounterred. 2.The bubbles were very small, and can be found around the die in between the die and the epoxy. 3.Curing time is 150 degC for 4 hours.
Electronics Forum | Sun Feb 22 15:46:09 EST 2015 | slave2anubis
Hi, my name is Dacian, and i run a mobile phone repair shop in Timisoara, Romania. Lately we decided to do more advance motherboard repair jobs, and a big problem that we have is, cleaning the board after we remove the chips. We repair manly iPhone,
Industry News | 2018-10-18 10:17:48.0
How to attach a thermocouple to a target PCB?
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
In this video, you will know the bga rework machine how to hot air. After watched it, please give Joy Rong a " like", thank you for your support. Product Application 1.Desolder and solder all the BGA Chip, remove and repair different motherboard BGA
How to Maintain a Reflow Oven Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve production efficiency and product quality. One of the most important tasks for properly maintaining a reflow ove
Conformal Coating Why, What, When, and How Conformal Coating Why, What, When, and How by: Greg Caswell; DfR Solutions Conformal coating is applied to circuit cards to provide a dielectric layer on an electronic board. This layer functions as a
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. Next, you need to create a schematic that specifies the PCB’s purpose and function at the electrical level. The schematic shows the location of components, so a mechanical engineer can understand how
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Packing-Instructions-DS-Series-Dispenser-22290017.pdf
. Raise the Z axis to the top of its Z travel so adequate room exists to remove the full length of the touch probe. For instructions on how to release the Z- axis brake, refer to Step 3 (pg 8). b
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