SMTnet Express, September 2, 2021, Subscribers: 26,737, Companies: 11,436, Users: 26,825 Tombstoning Of 0402 And 0201 Components: "A Study Examining The Effects Of Various Process And Design Parameters On Ultra-Small Passive Devices
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-microvias-and-printed-circuit-boards/
. Blind and buried vias tend to take up less space on a printed circuit board to allow for a fine I/O pitch. As a result, engineers have spent the past two decades refining the process to make these vias as small as possible , with the objective of using smaller die pads, including more chips in less space
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/725hf-high-flow-piston-valves
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