Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Industry News | 2018-10-18 10:18:58.0
Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?
Industry News | 2023-05-15 18:03:27.0
StenTech® Inc. is pleased to announce that Greg Starrett, Director of Sales, will present at the Long Island Chapter In-Person Technical Meeting on Wednesday, May 31, 2023. The event will be held at Zebra Technologies and will cover the topic of "Fine Feature Paste Printing, Stencil Design and Solder Technology."
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
| https://www.smtfactory.com/How-to-clean-the-bottom-of-a-Full-auto-SMT-Stencil-Printer-stencil-automatically-online-id3873969.html
? First of all, cleaning the bottom of the Full-auto SMT Stencil Printer stencil is also a factor to ensure the printing quality. Secondly, the cleaning mode and cleaning frequency should be determined according to the solder paste, stencil material, thickness, and opening size
ASCEN Technology | https://www.ascen.ltd/Products/Solder_paste_printer/394.html
. Automatic PCB solder paste screen printer with pecial manual lifting platform is simple and reliable structure, low cost, easy to manually adjust, you can quickly achieve different thickness of the
