Electronics Forum | Fri Jun 05 12:32:14 EDT 2020 | leandroxp
Hello people! how to solve problem of disconnects system. machine SI-G200? https://uploaddeimagens.com.br/imagens/aeO3o2c
Electronics Forum | Mon May 13 23:44:26 EDT 2019 | dami0629
if use tray cannot solve the problem, you can change from the design 1)Reduce the effect of temperature on PCB 2) PCB USE HIGH TG 3) BOARD THICKNESS TOO THIN 4) MODIFY THE BOARD SIZE 5) Reduce the V-CUT depth.
Industry News | 2021-02-12 16:57:01.0
New and experienced managers will gather at the Managers Forum at IPC APEX EXPO on March 8 to discuss strategies for thriving during times of crisis.
Industry News | 2012-06-11 18:41:32.0
Opening Keynote speaker is in the hands of the electronics manufacturing industry. IPC is asking industry to decide who would be the ideal keynote speaker to kick off three days of inspiring information and knowledge at IPC APEX EXPO 2013, February 19–21, in San Diego.
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
Events Calendar | Wed Jun 20 00:00:00 EDT 2018 - Wed Jun 20 00:00:00 EDT 2018 | ,
Everything You Need to Know About X-Rays
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? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · How to choose smt vacuum reflow soldering machine
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