We Offer: Robotic and semi-automatic hot solder dipping, Precision lead forming of critical devices, Tape-and-reel packaging, State-of-the-art Ball Grid Array (BGA) reflow process
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Electronics Forum | Thu Jun 08 23:26:28 EDT 2006 | Shawn Vike
We are a small company, reletivly new to doing our own SMT (1 year) and we are having an issue, I think. We manufacture many board with no problems, but we have one that constently defeats us. This particular PCB has ENIG finish, and we have had th
Electronics Forum | Thu Nov 09 23:27:53 EST 2000 | Craig
We are considering using gold plating on our fine pitch pcbs (as oppossed to HASL). We have heard of long term solder reliability problems with joint imbrittlment how bad is this and does it apply for all of the different plating processes the same?
Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
Industry News | 2011-02-09 14:58:43.0
Keeping on top of ever-changing environmental regulations around the world and understanding how those regulations impact electronics manufacturers and their suppliers are the first steps on the long and winding road to compliance. Providing a roadmap to compliance, the IPC It’s Not Easy Being Green Symposium, May 11–12, 2011, in Boston, Mass., will give companies up-to-date information on the laws and regulations that affect every link of the electronics manufacturing supply chain, from Europe and Asia to South America and the United States.
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Lead-free and Tin-lead Assembly
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/operator/comprehensive-soldering/
, Through Hole and Surface Mount components. This course also covers Fine Pitch Technology and SMT soldering course. Upon successful completion of this training, you will be assured that your workforce has a good understanding of the latest industry workmanship standards, and have learned latest methods to enhance
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SolderTip #47: How Long Does it Take to Make A Solder Joint? | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
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