New Equipment | Cleaning Equipment
Features : 1.Dedicated to water-based cleaning fluid to clean stencils, PCBA, etc. Process with high pressure spray system. 2.Double liquid tank, equipped with heating system, implementation needs cleaning and rinsing. 3.Technological proces
New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Electronics Forum | Tue May 31 08:51:26 EDT 2011 | kahrpr
I also never heard of that. Even if you measured the stencil tension what would be the spec be and how would that even relate to quality. Other than the stencil just flopping around I doubt that minor changes in screen tension are going to change any
Electronics Forum | Thu May 26 13:48:34 EDT 2011 | jorge_quijano
I used this for a couple of weeks some years ago, I was able to detect some issues whith some stenciles, but I did not use it for a long time, it may help you.
Industry News | 2018-10-18 09:46:58.0
Analysis of how to spot welding process
Industry News | 2018-10-06 11:20:42.0
How to Maintain a Reflow Oven?Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve production efficiency and product quality.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
This is video shows how to print a PCB using a prototype foil only stencil. The SMT prototype stencil (www.soldertools.net) is made from a high nickel content material able to offer repeatable high precision apertures. The steps of alignment, printin
We are VONSQUARE the start of a Smart Factory. VONSQUARE provides the standard infrastructure for SMT (Surface Mount Technology). By providing our customers with better solutions through our technology and know-how based on our experience, we are d
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
SMTnet Express, June 23, 2016, Subscribers: 25,290, Companies: 14,831, Users: 40,542 A Case Study on Evaluating Manual and Automated Heat Sink Assembly Using FEA and Testing Michael Sumalinog, Jesus Tan, Murad Kurwa; AEG, Flex (Flextronics
| http://etasmt.com/cc?ID=te_news_bulletin,13961&url=comment
How to Use Reflow Oven-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About I.C.T News Products Video Projects Service Join Us Contact Us Home About I.C.T
GPD Global | https://www.gpd-global.com/pdf/pbt/PBFT-Strain-Gauge-Retrofit-Procedure-PBT-0110M.pdf
. Set screws aside for use during installation of the new strain gauge. 2. Remove Mount Plate If an old style mount plate is in use, it will need to be replaced to maintain proper peel angle. 1
