Industry Directory | Manufacturer
Since 1971, Eagle Electronics Inc. has provided our Customers with the highest quality Printed Circuit Boards at fair and competitive prices.
Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
New Equipment | Fabrication Services
Fabricante de Placas de Circuito Impreso Flexibles-Rígidas Las placas de circuito impreso (PCB) rígidos-flexibles se fabrican combinando tecnologías de placas rígidas y flexibles. Estas placas de circuito están formadas por múltiples capas internas
Electronics Forum | Mon Apr 13 09:27:28 EDT 2009 | hxr6038
We had an issue with the finish, PCB manufacturer is telling that they had a problem with the Nickel rework, which resulted in 20% fall out. Please help me by providing the ENIG thickness for Flex boards, is it same as rigid boards as per IPC 4552. I
Electronics Forum | Wed Apr 15 13:07:12 EDT 2009 | RHK
Thank you! I am looking into this, but main idea is to use rigid board in place of flex.
Used SMT Equipment | Pick and Place/Feeders
Universal Genesis GC-120 Quad Beam w/ (4) Lightning Heads Complete Factory Closure Also Including: Universal Genesis GC-120 Quad Beam w/ (4) Lightning Heads Universal 4988C GI-14D Genesis Multi-Function Placement Machine, Flex-Jet Placement He
Used SMT Equipment | In-Circuit Testers
Fast Ramp ESS temperature chamber: Perfoms 5C to 25C per minute +125C to -20C based on 400lbs of aluminum and 1500 watts live load. Can be modified to perform -40C. Interior Dimensions: 2.14M X 2.14M X 2.14M / 7 feet X 7 feet X 7 feet. Elect
Industry News | 2011-12-21 22:41:39.0
Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.
Industry News | 2020-02-18 15:10:01.0
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Parts & Supplies | Pick and Place/Feeders
GSM Multi Pitch Feeder 16mm 47175802 we also supply other Universal accessories (GSM): part no description 46485701 CAMERA(PEC) 45269201 PC BD,PEC ILLUM ASSY 47598301 FLEXJET CLUTCH (OLD) 50121203 FLEXJET MirrorCLUTCH(NEW) 47509501 THETA ENCOD
Parts & Supplies | Pick and Place/Feeders
Part Name P/N TRACK FEEDER BASE LCD 45711101 MAGELLAN 2.3 MPP CAMERA A 49400003 AMP; PROGRAMMED SERVO 49706302 PCBD; CPU (6241 F) 48797301 KIT, ENCODER REPLACEMENT (with 50643902) 50644902 ENCODER, ROTARY, INLINE 4 50643902
Technical Library | 2020-11-15 21:22:11.0
The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with reference to nickel corrosion. The interpretation of the existing specification, that judges corrosion on 3 levels, is complex and if misinterpreted can lead to phantom failures. An obvious way to avoid any potential misinterpretation is to eradicate any evidence of corrosion completely.
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ Manufacturer Rockwell Automation Brand Allen-Bradley Product Description: Flex IO High Density
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
begin your search Close Search • Technology Roadmap 2017 2018 2019 2020 Material • Taconic • MAGTRON • FR 4 • ISOLA • Polymide-Flex • Metal Core Min. Dieletric Thickness 2 mil Max
