Industry Directory | Association / Non-Profit
RSN champions human rights with vulnerable communities in the mining and harvesting of raw materials found in products we use every day.
Tecnomatix Unicam is the driving force in Manufacturing Process Management (MPM) solutions for electronics manufacturers. Our solutions offer OEMs, CEMs, and EMS providers the best and most widely-used software tools for NPI, Box Build, and real-time Web-based quality, traceability, and process management. Keywords - Unicam, Fabmaster, eM-Assembly Expert, eM-Quality. WWW.TECNOMATIX.COM
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Electronics Forum | Tue Nov 05 10:15:01 EST 2002 | dason_c
We are using the custom pnuematic press to press the heat sink. You can use a force gauge to check the pnuematic cylinder or you can caluclate the force by the size of the cylinder, PI * squ R * Input pressure. Depend on the attachment method, by a
Electronics Forum | Tue Sep 05 14:26:29 EDT 2006 | sbt_blr
YOU CAN TRY IN 3M, THEY USE FOR THEIR BOOP TAPE TESTING
Used SMT Equipment | Pick and Place/Feeders
Make: Mydata Model: My200SX-14 Vintage: 2014 Software: TPSys 4.2.3b for Ubuntu Linux Details: • Electrical Two-Pole Test • HYDRA • Electrical Measurement • HYDRA High Speed • Fast Place Sequen
Used SMT Equipment | Pick and Place/Feeders
Mydata My 15E Pick and Place Date of Manufacture: 2005 Details: Electrical Two-Pole Test Electrical Transistor Test Shared Databases HYDRA HYDRA High Speed Use Outer Slots Y-Wagon Inserts, Magazine,
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Parts & Supplies | Pick and Place/Feeders
This splice tape is used for jointing carrier tapes in the SMT process, It is made of 2 silver tapes and release paper. Size: 8mm, 12mm, 16mm, 24mm Main Characteristic 1, Peeling-off force(N/25mm)by angle of 180 degree. 2,Retaining(H/25*25mm)
Parts & Supplies | Pick and Place/Feeders
Advantages of JUKI electric feeder With the electronic parts more sophisticated, more and more small, the use of electric feeder has become the standard placement of the placement machine, the old placement machine can use electric feeder has becom
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Thu Aug 15 00:00:00 EDT 2024 - Thu Aug 15 00:00:00 EDT 2024 | Duluth, Georgia USA
Atlanta Chapter In-Person Technical Meeting: State-of-the-Art Test Techniques
Career Center | San Diego, California USA | Engineering,Management
This position is responsible for the developing of our internal market intelligence on this product. Designs and develops sales tools for use by the sales force. Provides audit and assessment of equipment and manufacturing line process flow to cust
Career Center | Brooklyn, New York USA | Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | , | Engineering,Maintenance,Management,Production,Technical Support
Having 10+years of Experience in manufacturing (SMT),Field Engineer Globally For Universal SMT Equipment .
Career Center | Buford, Georgia USA | Technical Support
Over 9 years of Assembleon Electronic Manufacturing Equipment training and support. Primary machine experience: FCM I, II, and Multi-Flex, ACM Micro and AX. Dedicated CTT+ Certified Training Professional. Experienced in Instructor-led training an
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-force-pull?con=t&page=19
High Force Pull | Nordson DAGE X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
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