New Equipment | Assembly Services
The ferrite transformers are primarily designed for higher frequency applications. Power ferrite transformers provide benefits of low electrical losses and high permeability. The ferrite cores are constructed in compact sizes. Features and Specific
Standard: ASTM B338, ASTM B337, ASTM B861 Grade: Gr1 Gr2 Gr3 Gr5 Gr6 Gr7 Gr9 etc. Size(mm): OD 1.5~420 WT 0.3~16 Length 18000 Titanium alloy at high temperature has excellent elasticity, widely used i
Electronics Forum | Mon Nov 05 20:31:09 EST 2001 | davef
Most people do not intend to �solder� Type K thermocouples. They use solder to �attach� the thermocouple. Search the fine SMTnet Archives for a posting by Chrys Shea. 1 Common thermocouple types commonly used for thermal profiling are: * Type K �
Electronics Forum | Fri Sep 27 10:49:41 EDT 2013 | cyber_wolf
So I am reading about K type thermocouples in the IPC 7530 Guidelines and it says : "At temps above 250c it may suffer from temperature cycling hysteresis and may not be the best choice." Uhhh... It looks like the best choice is an N type thermocoup
Used SMT Equipment | In-Circuit Testers
Anritsu MS2724C Anritsu MS2724C Handheld Spectrum Analyzer 9 kHz to 20 GHz Anritsu's high performance handheld spectrum analyzer provides the wireless rofessional the performance needed for the most demanding measurements in harsh RF and physic
Used SMT Equipment | In-Circuit Testers
Anritsu's latest generation of handheld spectrum analyzers includes the MS2723C Spectrum Master. This represents the company's highest performance handheld spectrum analyzer from the MS272xC family. Exciting new features and options bring more value
Industry News | 2012-01-07 21:49:07.0
As EMS companies have ramped up speeds to meet the high demand for electronics, equipment manufacturers have responded by developing machines that quickly shift from handling one package style to another with fewer sacrifices in precision. To help industry determine the best equipment setup to meet needs for speed, capability and accuracy, IPC has released revision A to IPC-9850, Surface Mount Placement Characterization, making it far simpler to quantify the performance of placement equipment.
Industry News | 2008-03-28 11:48:22.0
Infolytica Corporation plans to release a new version of MagNet that will be available in the spring of 2008. Topping the list of new features is a total revamp of core loss calculations.
Technical Library | 2014-07-10 17:37:18.0
This paper studies and compares the effects of pull–pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package.The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.
8 KW, 20 KW typical Common Mode Range -100 VDC to +100 VDC peak-to-peak Normal Mode Range 1.5 V to 200 V peak-to-peak Overrange Protection ±150 VDC, continuous Hysteresis 150 millivolts, typical Wave Shape Sine, square, pulse, etc. Duty Cycle 10% to
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ Manufacturer : Triconex Product No. : 3504E Product type : High Density Digital Inp
