Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Manufacturer
Data I/O is the world's leading provider of manual and automated programming solutions for semiconductor (IC) devices. Data I/O's solutions, software and programming engine ensures devices are programmed correctly every time.
Repair many kind of Yamaha SMT m/c I/O Board (head or conveyor i/o board) : 1. KGT-M4570-000 2. KV8-M4572-004 3. KM5-M4582-010 4. All models of Yamaha SMT m/c Head/Conveyor I/O boards STOCK : HEAD I/O BOARD ASSY KV8-M4572-004
Small footprint, high density I/O for running any application requiring many points in a small, low-voltage solution. Convenient RJ-type connector for simple application and increased adaptability.
Electronics Forum | Sun Jan 17 20:36:49 EST 2016 | ttheis
I'm trying to configure the nozzle changers on my GSM1 machine because they were not configured when I bought it. I've figured out most of the setup with the UPS documentation, but I don't know what the I/O addresses are for the changers. Does anyon
Electronics Forum | Wed Jun 16 16:49:16 EDT 2010 | nguyennca
I have an error that stop FIP 3 from running. The error is "FIP OSS2 R3.1Bi CRTA event I/O. If anyone knows what this error is about then please help. Thanks
Used SMT Equipment | AOI / Automated Optical Inspection
Make: Yestech Model: 2050 Vintage: 2004 Details: • 22” x 20” in size • Vision Processor board set with PCB inspection software • Windows XP based user interface • CAD/placement interface software • Flat panel display • Industrialize
Used SMT Equipment | In-Circuit Testers
Teradyne Spectrum 8852 In Circuit Tester For Sale The tester is configured as follows: Front Cage FIB-0 / MX1 VP Prism (8) CC2-DIG-128ch FIB-1 / TEK Rear Cage (1) CC2-DIG-128ch VP-EXT MXI Note: Tektronix VX4101A (VXI MultiPaq Inst
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2018-02-12 12:28:00.0
GPD Global introduces its NEW full-featured benchtop dispensing robot system: Catalina. A benchtop system does not mean "no features". This compact and efficient semi-auto dispense robot provides you with numerous standard features: automatic vision, laser surface sensing, and automatic nozzle alignment and calibration.
Parts & Supplies | Circuit Board Assembly Products
KV8-M4570-02X I/O HEAD UNIT ASSY KV8-M4570-025 I/O HEAD UNIT ASSY YV100XG 5322 216 04676 I/O board P21 and 9965 000 11067 I/O core board original and new
Parts & Supplies | Pick and Place/Feeders
YAMAHA KV8-M4570-02X I/O HEAD UNIT ASSY YV100XG YAMAHA YS12/YG12 KHY-M4570-20X I/O HEAD BOARD ASSY KHY-M4570-01 I/O HEAD BOARD ASSY KHY-M4570-20 I/O HEAD BOARD ASSY KHY-M4570-201 I/O HEAD BOARD ASSY
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2007-02-01 09:57:15.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.
E9622729000 KE2010 X motor TS4509N2821E200 E9624729000 KE2010 Y motor TS4515N2821E201 E9629729000 KE2010 Z motor TS4633N2020E600 E9630729000 KE2010 T motor TS4632N2020E600 40000727 KE2050 Y motor TS4616N1020E200 40003253 KE2050 Z motor TS4633N20
E9622729000 KE2010 X motor TS4509N2821E200 E9624729000 KE2010 Y motor TS4515N2821E201 E9629729000 KE2010 Z motor TS4633N2020E600 E9630729000 KE2010 T motor TS4632N2020E600 40000727 KE2050 Y motor TS4616N1020E200 40003253 KE2050 Z motor TS4633N20
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BS in Electroincs Engineering(3.0 min GPA) 5+ years designing PC based or embedded products, Mentor graphics or similar EE CAE for circuit design, similation and maintenance, troubleshooting of PC chip set and processor level on
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BS Electronics Eng, 3+ years working with PC based products, knowledge of PC motherboards, chip sets, processors, PCI DRAM, I/O parts, Internal PC sub-assemblies, PC 99, PC2000, PCI and Windows. Duties/Functions: System quotes, s
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
SMTnet Express, September 27, 2018, Subscribers: 31,354, Companies: 11,055, Users: 25,237 Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction Carlos Tafoya, Gustavo Ramirez, Timothy O'Neill; AIM Solder Bottom
Heller Industries Inc. | https://hellerindustries.com/parts/4660k/
4660K - ADAPTOR, 16-24VDC D I/O HDIO16 Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
| https://www.feedersupplier.com/sale-21053098-kjj-m4580-044-yamaha-machine-parts-i-o-convy-board-assy.html
KJJ-M4580-044 Yamaha Machine Parts I O Convy Board Assy Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
