Industry Directory | Association / Non-Profit
An independent body of ESD experts with the mission to review the ESD robustness requirements of modern IC products for allowing safe handling and mounting
Industry Directory | Training Provider
Texts & training & consulting are provided by Robert Hanson, MSEE, on High-Speed Digital Design, EMI/EMC, SMT. Also basic electronics courses are offered.
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
New Equipment | Assembly Services
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
Used SMT Equipment | Pick and Place/Feeders
Make: SumsangModel: Decan S1 Details:1.Maximum PCB Handling Size: Standard size is 510x510mm, optional size is 1500x460mm, capable of handling PCBs up to 1500mm(L) x 460mm(W). 2.Mounting Speed: Up to 47,000 CPH (under optimal conditions). 3.Mounting
Used SMT Equipment | Pick and Place/Feeders
Make: SumsangModel: Decan S1 Details:1.Maximum PCB Handling Size: Standard size is 510x510mm, optional size is 1500x460mm, capable of handling PCBs up to 1500mm(L) x 460mm(W). 2.Mounting Speed: Up to 47,000 CPH (under optimal conditions). 3.Mounting
Industry News | 2003-06-20 08:31:58.0
Leading chip timing solutions provider manufactures fast memory interface clock generators for high-bandwidth applications
Industry News | 2022-08-08 07:10:23.0
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
Technical Library | 2009-06-17 18:52:27.0
The increased interest in halogen-free assemblies is a result of Non-Government Organizations (NGOs) exerting pressure on electronic equipment manufacturers to eliminate halogens. The NGOs primary focus is on resolving global environmental issues and concerns. As a result of an increase in the enormous "e-waste" dump sites that have begun showing up around the world, NGOs are pushing consumer electronic manufacturers to ban halogen-containing material in order to produce "green" products. Not only are these sites enormous, but the recycling methods are archaic and sometimes even illegal.This stockpiling and dumping has created growing political and environmental issues. In order to deal with this issue, the question of why halogens are a focal point must be addressed.
Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Mar 25 18:30:00 UTC 2024 - Mon Mar 25 18:30:00 UTC 2024 | Taoyuan City,
SMTA Taiwan Tech Forum 2024
Events Calendar | Sun Jun 07 18:30:00 UTC 2020 - Sun Jun 07 18:30:00 UTC 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Career Center | Rochester, New York USA | Engineering
Kodak - Design, develop, and evaluate new CCD image sensors and image sensor technology as part of a sensor research and development team.Requirements:Extensive experience in CCD designTraining in integrated circuit device physics and operationDemons
Career Center | San Jose, California USA | Research and Development
Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag
Career Center | Chennai, Tamilnadu India | Engineering
Testing (ICT-in circuit test,Functional test). Supervising in PCB assembly section (PTH). Defects & Inspection of PCB. Selection of active and passive components and IC’s, Generating a BOM (Bill Of Material). Handling Board testing with phase by pha
Career Center | Hyderabad, Telangana India | Engineering,Maintenance,Production
Experience in handling Process related issues throughout the Product Manufacturability. Programming and maintenance of SMT Pick and Place Machines of Mirae, Panasonic, NXT and MyData Programming and maintenance of Solder Paste Printer of DEK
| https://www.eptac.com/ask/bridging-two-adjacent-pins-on-an-ic/
Bridging Two Adjacent Pins on an IC - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-expert-2016-05-released_topic1890.xml
and Yellow statusChanged Transistor Outline (TO, DPAK) to DPAKChanged SOTFL to SOFL and added the IC component familyRemoved all A1 dimensions from Through-hole dimensional thumbnail imagesIncreased the Window Splitter line
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