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Industry Directory | Manufacturer
Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.
KSUN R05 JUKI Feeder Calibration It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of device pos
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
Electronics Forum | Thu Nov 24 05:56:32 EST 2005 | mskler
We are using QFP & other IC's in SMT but not using the antistatic pecautions. I want to know that what effect can be on IC's in future. Because we did not get any IC damege immidiatly. How long after this will affact the IC,s.
Electronics Forum | Thu Sep 23 09:59:56 EDT 1999 | Al Carrillo
Hi All, I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. thanks I appreciate your help.
Used SMT Equipment | In-Circuit Testers
Features: Including Windows 7 Pro OS Large board ability to accept up to 25"W x 26"L boards Four topside moving probes IC Opens TOS4 Inspection (2) adjustable bottoside probes
Used SMT Equipment | In-Circuit Testers
2006 Seica Strategy In-Circuit Tester Power: 110V; 60Hz Note: The system passes all system diagnostics. It will be licensed and supported by Seica. Features: O/S: Windows 7 960 Analog Channels Open IC Pin Detection Manual Bar Code R
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2003-02-17 08:21:41.0
HDI Sales Made Up Larger Share of Net Sales in 4Q
Technical Library | 2025-08-29 13:53:05.0
In electronics manufacturing, "underfill" refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit. It is also important in 3D ICs and advanced packaging technologies that involve stacking multiple chips or integrating multiple functions into a single package.
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
The CameraLink industrial digital cameras offer high performance in a very small footprint. The advanced 25M color CMOS sensor provides the absolute best image quality at an incredible frame rate of 30 fps! The camera Link Interface ensures High spee
The CoaXPress series cameras operate 72fps with ZERO-ROT function at 8bit/10bit CXP-6 4CH It provides advanced technology of vision solution Sensor : 25MP Color & Mono CMOS Sensor (Global & Rolling Shutter) Resolution : 5,120(H) x 5,120(V) Fram
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Taoyuan City,
SMTA Taiwan Tech Forum 2024
Career Center | San Jose/San Fran, California USA | Engineering
Our client, is a forerunner in high temperature semiconductor technology, seeks an Analog IC Design Engineer for their site in CA to work on product definition and designing Mixed Signal ICs. Established experience required in Analog & Mixed Signa
Career Center | Atlanta, Georgia USA | Purchasing
Our client has immediate need for a Purchasing Manager. Firm manufacturers electronics; PCB's, IC's. BS and/or experience. Location is mid-South.
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control
AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
3D ICs With TSVs - Design Challenges And Requirements 3D ICs With TSVs - Design Challenges And Requirements As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up to 3D ICs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/information/ics-university-mailing-list
ICS University Mailing List Industrial Coating Systems Corporate | Global Directory | Languages Division Only All of Nordson Application Solutions Powder Coating Liquid Painting Container Coating Sealant Adhesive Systems Automotive Assembly UV Curing Systems Industries Aerospace Agriculture
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry
