Electronics Forum | Mon Feb 21 21:28:13 EST 2005 | abhirami
Davef, We see increased IMC thickness for electroless Ni and the brittle mode failure occurs much earlier in multiple reflows, exposing IMC layers. Not good for board level reliability.Regards. GV
Electronics Forum | Tue Jul 14 07:23:50 EDT 2020 | researchmfg
There is a misunderstanding that people think the IMC layer grows the thicker the stronger soldering strength. The IMC layer can be grown and distributed evenly at the interface location will be good enough. Once the IMC layer grows too thick and ove
Industry News | 2009-03-06 15:54:16.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.
Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
:00pm This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints. The reliability discussed includes joint mechanical properties, development of type and extent of intermetallic compounds (IMC
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
(Note that in SnPb solder joint, Cu6Sn5 present at the interface between SnPb solder and the Cu pad) and Ag3Cu intermetallic compound (IMC
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