Electronics Forum | Sat Aug 22 05:19:42 EDT 2009 | ghepo
Dear Eric, in my opinion this is a very complex problem, that require to know many details for answer. For example : 1) what about the PCB finishing ? Have you verify the quality of they ? 2) what about the solder paste (the exactly composition)? 3)
Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef
1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry News | 2009-09-17 15:00:44.0
OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that research sponsored by the company was recognized by the University of Queensland as one of the best examples of a successful cooperation between the university and the industry.
Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
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