Electronics Forum | Mon Jun 11 21:56:41 EDT 2001 | davef
Continuing, I�ve optioned about the uselessness of shear testing of solder connections on this forum previously. So, the points that you make about the elusiveness of developing a standard for measuring solder connection strength is well taken. I�l
Industry News | 2025-03-17 19:03:37.0
SHENMAO America, Inc. continues to advance soldering solutions with its PF925 High-Reliability Solder, designed to improve mechanical strength, thermal stress resistance, and defect prevention in high-reliability electronics manufacturing. The PF925 alloy enhances solder joint integrity through dispersion strengthening, solid solution strengthening, and inhibition of brittle intermetallic compound (IMC) growth, ensuring long-term durability in demanding applications.
Industry News | 2009-03-06 15:54:16.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.
SMTnet Express, January 27, 2022, Subscribers: 25,985, Companies: 11,506, Users: 27,032 Fracture Toughness Analysis of Epoxy-Recycled Rubber-Based Composite Reinforced with Graphene Nanoplatelets for Structural Applications
| http://etasmt.com/cc?ID=te_news_bulletin,13161&url=_print
. Controlled tin flow direction; 5. The soldering surface does not move during reflow soldering. 1. Appropriate heat. Appropriate heat means that for the reflow soldering materials, there must be enough thermal energy to melt them and form an intermetallic interface (IMC
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS). Introduction The increasing awareness of health risk associated with lead (Pb
