Industry Directory | Consultant / Service Provider / Manufacturer
EMS company Laser SMT stencils mfg Tape converting , slitting , die cut Laser modules mfg Distribution materials,components ISO 9001:2015 ISO 13485:2016 AQAP 2110:2016 EN 9120:2018
ScanPLACE provides a sophisticated and user-friendly alternative to complex CAM software packages and inaccurate, time consuming manual inspection and programming methods that cost assembly houses productivity, time and money. Programming Using a
New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Electronics Forum | Fri Nov 08 08:52:54 EST 2002 | dphilbrick
Juan There are many things that cause this and the first thing I would do is request quality records from your board fab facility on that particular lot. If they are unwilling to give them to you this is a good sign they had a processing problem. Th
Electronics Forum | Thu Jun 20 04:49:34 EDT 2002 | scottxiao
according to the ressult of cross-section and removing the component, I find there is no black area in the left pad, and the IMC is also normal, so the black nickle is less impossible. the PCB material is not common FR4, just some thing like ceramic,
Industry News | 2018-10-18 08:55:30.0
Nitrogen Protection Reflow Oven
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Parts & Supplies | Assembly Accessories
SMT MACHINE GENUINE JUKI FEEDER SPARE PARTS JUKI FEEDER REEL STOPPER SHAFT E6658706000 JUKI Pats Specifications: Brand Name JUKI FEEDER REEL STOPPER SHAFT Part number E6658706000 Model JUKI CF AF EF ETF ETFR FEEDER SPARE PARTS Ensure Test
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Parts & Supplies | Assembly Accessories
FUJI NRG1022 CAP FUJI NRG1040 NUT FUJI NRG1060 LOCK FUJI NRG1061 HOLDER, CAP FUJI NRG1070 CAP HOLDER FUJI NRG1072 HOLDER, CAP FUJI NRG1080 HOUSING FUJI NRG1081 HOUSING FUJI NRG1090 SPRING FUJI NRG1110 GUIDE FUJI NTB1830 BEARING THRUST
Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113 Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
| http://etasmt.com/cc?ID=te_news_industry,4161&url=_print
Lead-free era makes whether need nitrogen in reflow a hot topic . As the lead-free solder flow resistance, wettability is not as good as lead solder, especially when the circuit board pad processed with OSP (organic protective film bare copper), the pad
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
component’s candidacy for bottom-side attachment:2 Cg/Pa Where C = component’s weight in grams; P = total pad area in square inches (g/in2 must be ≤ 30 for second-side mount
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