Electronics Forum | Mon Feb 19 17:34:02 EST 2007 | GS
Thank You Pavel and Dave, Unfortunately I do not have IPC-4554. Anyway I 0.6-1.0umm is what I remember, and confirmed by reading also through leterature available on google. I was just going to understand if it possible to obtain more thickness
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Industry News | 2017-11-15 20:16:33.0
Metcal announces that it was awarded a 2017 Global Technology Award in the category of Hand Soldering for its CV-5200 Soldering and Rework Systems with Connection Validation technology. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. This marks the company’s fifth award since its introduction at the beginning of 2017.
Technical Library | 2012-12-13 21:20:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) surface finish. We used lead-free solder of Sn-1.2Ag-0.5Cu-Ni (LF35). We found multiple micro-voids of less than 10 µm line up within or above the intermetallic compound (IMC) layer. The number of micro-voids increased with the palladium (Pd) layer thickness. Our results revealed that the micro-void formation should be related to (Pd, Ni)Sn4 phase resulted from thick Pd layer. We propose that micro-voids may form due to either entrapping of volatile gas by (Pd, Ni)Sn4 or creeping of (Pd, Ni)Sn4.
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
SMTnet Express, May 17, 2018, Subscribers: 31,044, Companies: 10,939, Users: 24,723 Statistical Aspect on the Measuring of Intermetallic Compound Thickness of Lead Free Solders Azman Jalar, Maria Abu Bakar, Roslina Ismail, Abdul Razak Daud
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
reference [7], an optimum gold thickness was determined. At the low end, the gaps in the plating resulted in voiding. At the high end, excess IMC growth occurred during reflow and reliability testing. The bondline thickness (BLT) of indium solder preforms is
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Suthakaran, Russell Brush, Doug Perovic Abstract 31-1 Influence of Electroless Pd Plating Film Thickness on Solder Joint Relibility of ENEPIG Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki
