New SMT Equipment: immag without ni (9)

Picotest M3500A Digital Multimeter DMM Meters

Picotest M3500A Digital Multimeter DMM Meters

New Equipment | Test Equipment

Picotest M3500A Digital Multimeter     Support USBTMC     Stability, Speed and Accuracy     High Performance: 2000 readings/sec     Multi-Point Scan     19 Full-Featured Functions     Temperature Measurements     Dual Displays with 3-color An

Test Equipment Connection

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

Electronics Forum: immag without ni (30)

Electroless Nickel without gold immersion

Electronics Forum | Tue Aug 20 18:15:02 EDT 2002 | davef

Haaaaa!!!! Soldering to plastic!!!! An apt analogy!!! I like to compare it to soldering to dirt. Some thing. In fact, you are soldering on nickel, when soldering on many things. It�s just that the gold, er Pd, flash enables the wetting mechanism

beryllium copper

Electronics Forum | Tue Mar 14 16:26:45 EST 2006 | patrickbruneel

BeCu is not solderable without plating Cu, Sn, Ag, Ni etc. The solder joint will only be as strong as the bond strength of the solderable plating to the BeCu Pat

Industry News: immag without ni (32)

Electronics Workbench Announces Multisim 7 and Multicap 7 for Professional Circuit Engineers and Designers

Industry News | 2003-05-06 09:05:12.0

New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance

SMTnet

ADLINK Joins Network Intelligence Alliance To Drive INNOVATION FOR Next-Generation Network Solutions

Industry News | 2014-11-10 11:34:02.0

ADLINK Technology has become a member of the Network Intelligence Alliance (NI Alliance), an industry organization created for collaboration among vendors of products and solutions based on network intelligence. Participation in the NI Alliance will help ADLINK to build and market innovative solutions for customers seeking to deliver advanced, cutting-edge switching, transcoding, and deep packet inspection solutions for communication and networking applications.

ADLINK Technology, Inc.

Technical Library: immag without ni (2)

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Technical Library | 2013-08-29 19:52:43.0

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...

Agilent Technologies, Inc.

Effect of Thermal Aging on Solderabilityof ENEPIG Surface Finish Used in Printed Circuit Boards

Technical Library | 2021-12-29 19:52:50.0

Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.

Purdue University

Videos: immag without ni (2)

Indium's NanoBond® Process

Indium's NanoBond® Process

Videos

How the NanoBond® Process works

Indium Corporation

Brand new and original

Brand new and original

Videos

Sales manager: Mac Xie Mobile: +8618020714662(Whatsapp) Email: at@mooreplc.com Skype: +8618020714662     ✦Product Description✦   Module Type Servo Control Module Series SLC 500 Part Number/Catalog No. 1746-

MOORE Automation Ltd.

Express Newsletter: immag without ni (181)

SMTnet Express August 29 - 2013, Subscribers: 26233

Hyland; Agilent Au over Ni on Cu is a widely used p

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN

Partner Websites: immag without ni (31)

Temperature Conditioning

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/additional-product-sub-type/temperature-conditioning?con=t&page=3

: Temperature Conditioning Roof Ditch Applicator Industrial Coating Systems Robot end of arm mounted dispense valve with tooling for vision control BPA-NI Coating for Container Industrial Coating Systems BisPhenol A Non-Intent (BPA-NI

ASYMTEK Products | Nordson Electronics Solutions

Auction - TS Leiterplatten | The Branford Group

| http://www.thebranfordgroup.com/dnn3/Auction/TSLE0523.aspx

Höllmüller LPI Developer with flexible transport Pill Pre-Clean Mec Etch Bond for paint + inner layers Höllmüller Anti-Tarnish for inner layers Mec Laif Shadow Line - Direct Metallization Laif Resist Stripper with cyclone Schmid Tin Stripper Laif Ni/Au manual electroplating w/post-cleaning + dryer Laif Ni/Au – chem


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