New Equipment | Wave Soldering
The SolderStar WaveShuttle PRO is a wave optimizer that quickly allows you to analyse, improve and gain control of your wave soldering process. This unique fixture incorporates two measurement systems to give the most comprehensive and repeatable mea
New Equipment | Wave Soldering
The only portable wave soldering machine optimizers with statistical process control (SPC) The wave soldering process is one of the most challenging procedures to set up. The ECD WaveRIDER® NL 2 greatly simplifies wave solder set up and ensures perf
Used SMT Equipment | Soldering - Selective
ACE Production Technologies KISS 101A Selective Soldering System The KISS-101A is an entry-level selective soldering machine, manual load, 12″ x 12″ board size. Best suited for medium volume, smaller CM's for light to moderate duty. The KISS-101A
Used SMT Equipment | Soldering - Selective
ACE Production Technologies KISS 101A Selective Soldering System The KISS-101A is an entry-level selective soldering machine, manual load, 12″ x 12″ board size. Best suited for medium volume, smaller CM's for light to moderate duty. The KISS-101A is
Industry News | 2018-10-18 09:46:58.0
Analysis of how to spot welding process
Industry News | 2018-05-18 11:06:33.0
Clearwater, FL - Solderstar, a leading provider of thermal profiling equipment for the Electronic Manufacturing sector, will showcase its innovative range of dataloggers and smart thermal profiling products at the forthcoming Michigan Expo & Tech Forum.
The following video guides the user through a typical data collection process. These steps may vary depending on the process your company uses. Categories: WaveRIDER, WaveRIDER SPC (v5.2x)
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
] Investigation Specifics: 84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs Sn63 solder paste Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes Thermal cycling: 0°C-100
