We are electronic contract manufacture and we also have JIT facility. Our head office located in Markham, Ontario, Canada. We do have a facility in USA, MEXICO and BRAZIL.
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Full Range Of ICT Test Solutions And Services , Full DFT Analysis, Contract Engineering. Turnkey Teradyne Teststation (GenRad 228x), Turnkey Teradyne 18XX, Turnkey Agilent 3070 Series and Full Flying Probe Solutions
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
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Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol
Electronics Forum | Wed Jan 08 16:27:11 EST 2020 | rmitchell
We have a PCB with the dual sided connector that slides on from the edge and has leads on the top and bottom sides of the PCB. It has 20 leads on each side of the PCB with with about .8mm pitch. The PCB also has a gold grounding strip on the edge fo
Industry News | 2003-04-09 08:25:50.0
A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.
Industry News | 2018-10-18 09:06:41.0
Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors
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Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups
. According to J-STD-001, 4.5.1 Gold Removal From at least 96& of the surfaces to be soldered of the through hole component leads with 2.54 um [100uin.} or more of gold thickness
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