Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other
Ludee Circuits offer RoHS PCB.We could offer leadfree HASL,Entek, flash gold, immersion gold, immersion silver, immersion tin finishing based on standard FR-4, CEM-3 materials, Teflon, Rogers RO4000 series, as well as high Tg S1170 materials.
New Equipment | Education/Training
This is a "real life" how to solder kit including both throughhole and SMT components. The board has ground planes that you would find in a real PCB assembly. Upon completion the sudents will have a working board. If you are trying to instruct new
New Equipment | Assembly Services
- 6 layer with immersion silver finish. - Plating on the edges. Advantages: - Special plating to ensure plating remains on the edges of the board. - 3~6 working days for prototypes, for prototype production. Edge Plating The requirement for edge p
Electronics Forum | Tue Sep 23 10:06:29 EDT 2008 | Sean
Hello Vlad, Davef, Your valuable inputs are much appreciated. Many thanks, Sean.
Electronics Forum | Sat Sep 20 07:11:28 EDT 2008 | Sean
Hello All, I used to hear that PCB with immersion silver finishing, its non component location pads, tend to be discolour (Yellowish) after went through heat cycle, such as reflow oven. However, if the component solderbility on the PCB is OK, can w
Used SMT Equipment | Board Cleaners
Make: Aqueous Technologies Model: Stencil Washer LD Vintage: 2010 Application: Solder Paste Removal Wash Tank Capacity: 35 Gallons (132 Liters) Maximum Stencil Size: 29" x 29" (74cm x 74cm) Full Immersion Ultrasonic: 1000 Watt Side Mounted Tran
Used SMT Equipment | Board Cleaners
Cleaning tank with hopper, ultrasonic, spray under immersion. 2 x closed loop rinse tank. turbo dryer. Automatic robot with 6 carriers. tanks are 60 x 40 x 60 (L W H)
Industry News | 2003-02-07 09:13:12.0
The Sessions Covered Current and Emerging Technologies
Industry News | 2013-08-07 09:58:46.0
The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.
Parts & Supplies | Circuit Board Assembly Products
PULANG TECHNOLOGY CO,.LTDOffers electronic manufacturing services including PCB designing, electronic contract manufacturing including electronic product design, electronic product development, electronic product repair, PCB manufacturing, electronic
Parts & Supplies | Board Cleaners
112256 OPTO SPACER CAMERA MOUNT EA CNY List Price-UM Lead Time: 10 Days 191.86 -- EA 112512 265 CAMERA MOUNT EA CNY List Price-UM Lead Time: 13 Days 2997.75 -- EA 113892 ADAPTER LOOM X CAMERA MOTOR FLEX. EA CNY
Technical Library | 2015-11-25 14:15:12.0
In this study various printed circuit board surface finishes were evaluated, including: organic solderability preservative (OSP), plasma finish (PF), immersion silver (IAg), electroless nickel / immersion silver (ENIS), electroless nickel / immersion gold hi-phosphorus (ENIG Hi-P), and electroless nickel / electroless palladium / immersion gold (ENEPIG). To verify the performance of PF as a post-treatment option, it was added to IAg, ENIG Hi-P, and ENEPIG to compare with non-treated. A total of nine groups of PCB were evaluated. Each group contains 30 boards, with the exception on ENIS where only 8 boards were available.
Technical Library | 2022-03-16 19:41:17.0
Creep corrosion occurs in electronics assemblies and it is reminiscent to electromigration but does not require electrical field to drive the reaction. Corrosive elements and moisture must be present for creep corrosion to occur. Sulfur is the most prominent element to cause creep corrosion in environments such as paper mills, rubber manufacturing, mining, cement manufacturing, waste water treatment etc., also including companies and locations nearby such industries. The main part of printed circuit board assembly (PCBA) to be affected is the PCB surface finish. Especially immersion silver is prone to creep corrosion, but it sometimes occurs in NiPd (lead frames), and to a lesser extent in ENIG and OSP surface finishes. As the use of immersion silver is increasing as PCB surface finish and electronics are more and more used in harsh environments, creep corrosion is a growing risk. In this paper we will present the driving forces and mechanisms as well as suitable tests and mitigation strategies against creep corrosion
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
This is what the fully assembled How to Solder Kit looks like. Depress the button and one of the LEDs will remain lit at the end (it eventually times out). You can add some kind of template so each LED position has some meaning. The PCB has a real gr
Career Center | Burnet, Texas USA | Sales/Marketing
Austin American Technology is seeking Independent Manufacturers Representation for our Arizona and New Mexico territory. AAT is looking for a representative organization with complementary lines of capital equipment that would like to add the world
Career Center | Burnet, Georgia, Mississippi, Tennesse, Kentucky | Sales/Marketing
Austin American Technology is seeking Independent Manufacturers Representation for our Arizona and New Mexico territory. AAT is looking for a representative organization with complementary lines of capital equipment that would like to add the world
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html
) Plating for Printed Ciruit Boards IPC-4553 - Specification for Immersion Silver Plating for Printed Ciruit Boards IPC-4554 - Specification for Immersion Silver Tin for Printed Ciruit Boards IPC-4562