Industry Directory | Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
Asia Pacific Circuits is one of Asia's leading Electronic Manufacturing Services companies, committed to providing high quality PCB and PCBA Contract Electronics Manufacturing Services.
Description Make/Brand - ASM / Siemens Model - Siplace SX-1 Year - 2021 VIN/Serial - P2656G-12046944 Lot# - 13360-27 Condition - Used/See Description Inventory ID - E629113 ASM / Siemens Siplace 'SX-1' Placement Machine, S/N P2656G-12046944
New Equipment | Education/Training
This is a "real life" how to solder kit including both throughhole and SMT components. The board has ground planes that you would find in a real PCB assembly. Upon completion the sudents will have a working board. If you are trying to instruct new
Electronics Forum | Mon Aug 07 09:04:09 EDT 2006 | molos21
Hi everyone, I am starting to use the lead free process and I had a few wetting problems (solder did not reach top side) at the wave soldering process once the pcb had passed our smt line (one heat pass). From what I understand, I have had a problem
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Used SMT Equipment | THT Equipment
Amistar Axial Insertion Machine, Model A1800, s/n 4B1431. Power requirments: 115V, 2 A, .23 KVA. Auction Item: Electronic Manufacturing Equipment Market #189 North America - SMT / PCB Mfg Assets - May 27-29, 2014
Used SMT Equipment | Pick and Place/Feeders
Description Make/Brand - ASM / Siemens Model - Siplace SX-2 Year - 2020 VIN/Serial - P2600G-12046497 Lot# - 13360-19 Condition - Used/See Description Inventory ID - E652113 ASM / Siemens Siplace 'SX-2' Placement Machine
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Parts & Supplies | Assembly Accessories
SMT MACHINE GENUINE JUKI SPARE PARTS JUKI TR4SN TR6SN X BALL SLIDE IKO BSP1045SL E1107717000 JUKI Pats Specifications: Brand Name JUKI TR4SN TR6SN X BALL SLIDE Part number E1107717000 Model IKO BSP1045SL Ensure Test in machine confirmation
Parts & Supplies | Assembly Accessories
SMT MACHINE SPARE PARTS JUKI TR4SN 6SN Z MOTOR E96047170A0 TS4509N1021E100 Specifications: Brand Name JUKI MOTOR Part number E96047170A0 Model TS4509N1021E100 Ensure Test in machine confirmation Guarantee 3 month usage for machine JUKI M
Technical Library | 2018-07-11 22:46:13.0
For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
https://www.ascen.ltd/Products/conformal_coating_equipment//580.html PCB Conformal coating machine is used to paint conformal coating onto full LED panel to avoid PCB moisture,sault and static.It can be full panel conformal coating or selective coati
https://www.ascen.ltd/Products/conformal_coating_equipment//580.html PCB Conformal coating machine is used to paint conformal coating onto full LED panel to avoid PCB moisture,sault and static.It can be full panel conformal coating or selective coati
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | BANGALORE, Karnataka India | Quality Control
New Model Evaluation • Testing & Evaluation of New TV models as per the relavant standards & release the defect free product for Mass Production • Measurement of audio parameters like Max out put, distotion, S/N ratio, hum, buzz etc • To conduct aud
SMTnet Express, April 11, 2019, Subscribers: 31,842, Companies: 10,737, Users: 25,981 Soldering Immersion Tin Credits: Atotech The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_reflow_ovens_electrovert.html
SMT & PCB Equipment, Reflow Ovens, Electrovert OmniFlow 14 Reflow Oven Electrovert OmniFlow 14 Relow Oven Left to Right Edge Rail and Mesh Rail Heat Option Independent High Temp Safety Circuit Inert Heating Module Integrated Oxygen Analyzer Quick Purge Auto Chain Oilers
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/materials-available/
(including Aluminum Bonding) Nelco 4000-13 160 Tg Allied 408 180 Tg Polyimide 230 Tg BT Epoxy 180 Tg Teflon Taconic Arlon Others including Flex Finishes include: Immersion Tin (Sn) Immersion Sliver (Ag) Immersion Gold (Au) ENTEK/OSP
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
