Industry Directory: import package (34)

HongCheng import & Export co.,Ltd

Industry Directory | Equipment Dealer / Broker / Auctions

Buy and selling used smt,semi, Robot ,CNC and all used machines

UNISOFT Corporation

UNISOFT Corporation

Industry Directory | Consultant / Service Provider

PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!

New SMT Equipment: import package (83)

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

New Equipment | Software

ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc.  ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat

UNISOFT Corporation

Unisoft ProntoGERBER CONNECTION - Gerber Translation Software

Unisoft ProntoGERBER CONNECTION - Gerber Translation Software

New Equipment | Software

If you have only Gerber data files to work with then ProntoGERBER-CONNECTION can help you!  ProntoGERBER-CONNECTION imports raw Gerber data and allows the user to add intelligent information to the shapes on the display and create process assembly

UNISOFT Corporation

Electronics Forum: import package (119)

Re: Component solderability problems TO263 package

Electronics Forum | Wed Aug 09 22:00:44 EDT 2000 | Dave F

Hey Charles!!! Where in earthly heaven did you get a TO263 with "large solderable tab (approx 8mm square) on the back and 5 leads"? All the TO263s that�ve reached-up and smacked me have been "TO220s" with a modified tab and three leads that are f

Re: help help! Water clean for CSP/BGA package

Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

Used SMT Equipment: import package (14)

Asymtek Dispensemate 555 Dispensing System

Asymtek Dispensemate 555 Dispensing System

Used SMT Equipment | Adhesive Dispensers

Asymtek Dispensemate 555 Dispensing System The DispenseMate 550 Series brings new dispensing power to a compact package. In a benchtop format, many of today's advanced automated dispensing features are available. It is ideal for batch processing or

Recon Inc

Anritsu MA2442D

Anritsu MA2442D

Used SMT Equipment | General Purpose Test & Measurement

Description Anritsu MA2442D High Accuracy Sensor 10 MHz to 18 GHz Condition Used Serial Number 033870 Term of Delivery Import duties, taxes and charges are not included in the item price. These charges are the buyer's responsibility

GenTech Test Equipment Co., Ltd.

Industry News: import package (730)

MIRTEC PRESENTS TWO AWARDS DURING SMT/HYBRID/PACKAGING 2013

Industry News | 2013-04-18 11:14:54.0

MIRTEC,announces that it presented two awards to its sales distributors on Wednesday, April 17, 2013 during the SMT/Hybrid/Packaging exhibition in Nuremberg, Germany.

MIRTEC Corp

Parts & Supplies: import package (46)

Yamaha Lead Cutting Automatic Taped C

Yamaha Lead Cutting Automatic Taped C

Parts & Supplies | SMT Equipment

Lead Cutting Automatic Taped C-306C Specifications   This lead forming machine is used to lead-cutting and forming of taped resistors, diodes, and other axial components.        FEATHERS    1.         It is used to cut radial leads

Qinyi Electronics Co.,Ltd

Siemens Feeder cable 00325454S01

Siemens Feeder cable 00325454S01

Parts & Supplies | Pick and Place/Feeders

00384300-01 SIPLACE Maintenance Manager V1.0, consisting of SIPLACE Maintenance Manager and Maintenance Plan Builder, is an additional software package to SIPLACE Explorer. Both software modules are designed for visualization, observation, analyses a

Qinyi Electronics Co.,Ltd

Technical Library: import package (23)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Technical Library | 2023-01-17 17:58:36.0

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.

Heller Industries Inc.

Videos: import package (735)

Example of how to import raw GERBER files and convert them to useful production data. Create real reference designators, theta rotation, part numbers, X/Y component pin and center geometries, values, tolerances, etc.

Example of how to import raw GERBER files and convert them to useful production data. Create real reference designators, theta rotation, part numbers, X/Y component pin and center geometries, values, tolerances, etc.

Videos

ProntoGERBER-CONNECTION software is used by electronic manufacturer & imports raw Gerber data & allows the user to add intelligent information to the shapes on the display and creates real reference designators, theta rotation, part numbers, X/Y comp

UNISOFT Corporation

Example of how to import CAD data and BOM files, and export to an assembly machine program set up file.

Example of how to import CAD data and BOM files, and export to an assembly machine program set up file.

Videos

www.unisoft-cim.com/pcbplace.htm - The ProntoPLACE module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB assembly machines in minutes. ProntoPLACE programs most popular surface mount (SMT) place

UNISOFT Corporation

Training Courses: import package (4)

Component Placement 101 Training Course

Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

Surface Mount Technology Association (SMTA)

CAM350/DFMStream Product Training Course

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

DownStream Technologies LLC

Events Calendar: import package (4)

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Surface Mount Technology Association (SMTA)

Atlanta Chapter: Tech-Day

Events Calendar | Thu Apr 22 00:00:00 EDT 2021 - Thu Apr 22 00:00:00 EDT 2021 | ,

Atlanta Chapter: Tech-Day

Surface Mount Technology Association (SMTA)

Career Center - Jobs: import package (10)

SMT Programmer

Career Center | Austin, Texas USA | Engineering,Technical Support

Adecco Engineering and Technical has a current job opportunity for SMT Programmer in Austin, TX. The position is a contract to hire in the nation's fastest growing industry. JOB REQUIREMENTS Strong experience SMT machine programming and ability t

Adecco Engineering & Technical

Satellite Communications and RF Payload Engineering

Career Center | Littleton, Colorado USA | Engineering

If you have experience in Satellite Communications or RF Payload Engineering we have advancement opportunities that may be of interest to you. Available positions are in disciplines such as: Shaped Reflector design and analysis Antenna compo

Lockheed Martin Corporation

Career Center - Resumes: import package (3)

SMT Manufacturing

Career Center | , | Engineering,Maintenance,Production

Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma

Sales & Business Developement

Career Center | Bangalore, Karnataka India | Sales/Marketing

Dear Mam / Sir, Greetings, My 22 years of Sales & Business Development experience in “Capital Equipments” (Plastic processing m/c's, Turn-key packaging m/c’s, etc.) should be of interest to a fast growing company like yours. My experience in vario

Express Newsletter: import package (662)

Partner Websites: import package (352)

Importing Your BOM Files | Unisoft Manufacturing Software | Unisoft

| https://unisoft-cim.com/view-markup_bom_importing-your-bom-files.html

    Importing X/Y center rotation files Importing BOM Files The Unisoft software can import virtually any Bill Of Materials (BOM) file format.  The BOM file contains the component parts, etc

AOI - Automated Optical Inspection Systems Archives - Page 2 of 2 - Lewis and Clark

Lewis & Clark | http://www.lewis-clark.com/product-category/aoi/page/2/

• CAD import, export, and conversion software • SPC data collection and reporting software • Control library manager software • Offline programming and rework software • BX Cart • 22

Lewis & Clark


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HongCheng import & Export co.,Ltd
HongCheng import & Export co.,Ltd

Buy and selling used smt,semi, Robot ,CNC and all used machines

Equipment Dealer / Broker / Auctions

DONGGUAN HUMEN
Dongguan, 30 China

Phone: 13560819457