Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
Industry Directory | Equipment Dealer / Broker / Auctions
Buy and selling used smt，semi， Robot ,CNC and all used machines
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Sun Oct 27 21:45:32 EDT 2013 | niru
What are the parameters that are more important for perfect soldering and how are they defined.
Electronics Forum | Mon Dec 08 05:05:18 EST 2003 | wurzlseppl
I�m looking for a cad import tool for the Sanyo TCM 1100 or Universal HSP 4790/91/92. Does anyone have a tool, or how do you handle thze cad import? Thank you
Used SMT Equipment | Pick and Place/Feeders
Product number: KD - 2077 Products in detail Features: High speed dispensing/adapt to more stablerange Equal to KE series ofhigh-performance/operability Attaches great importance to thecompatibility and environment design Parameters: Substrate
Used SMT Equipment | SMT Equipment
Product name: KD - 2077 high-speed dispensing machine Product number: KD - 2077 Products in detail Features: High speed dispensing/adapt to more stable range Equal to KE series of high-performance/operability Attaches great importance to the
Industry News | 2018-07-02 07:23:51.0
Heller Industries Announces That It Will NOT Be Subject To The 25% Import Duty on Reflow Oven Purchases
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Parts & Supplies | Screen Printers
Name: imported stainless steel mixing knife (metal / wood handle) Part Number: Universal Description: Imports of stainless steel mixing knife (metal / wood handle); stainless steel mixing knife Applicable models: all presses Imports of stai
Parts & Supplies | SMT Equipment
Imported stainless steel mixing knife Name: imported stainless steel mixing knife (metal / wood handle) Description: Imports of stainless steel mixing knife (metal / wood handle); stainless steel mixing knife Applicable models: all presse
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
ProntoGERBER-CONNECTION software is used by electronic manufacturer & imports raw Gerber data & allows the user to add intelligent information to the shapes on the display and creates real reference designators, theta rotation, part numbers, X/Y comp
www.unisoft-cim.com/pcbtest.htm - In minutes the Unisoft ProntoTEST-FIXTURE software translates CAD & BOM files into real reference designators, netlists, X/Y component pin geometries, values, tolerances, part numbers, etc. This data is used by Test
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Events Calendar | Tue Sep 22 00:00:00 EDT 2020 - Tue Sep 22 00:00:00 EDT 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
Events Calendar | Tue Mar 28 00:00:00 EDT 2017 - Thu Mar 30 00:00:00 EDT 2017 | Penang, Malaysia
South East Asia Technical Conference on Electronics Assembly
Career Center | Torrance, California USA | Clerical,Sales/Marketing
Qualmax is a SMT equipment distributor giving in-line turn-key solutions to the customers. We are currently looking for a sales coordinator, who will primarily do the following jobs; -Technical/commercial communication with the suppliers -Technical
Career Center | Buffalo, New York USA | Engineering,Production,Quality Control,Technical Support
The Process Engineer will lead overall improvement in the area of yield enhancement, reduction in non-conforming components and assemblies, as well as cost saving initiatives. An important attribute of this position is the use of SPC for variation i
Career Center | chennai, India | 2017-04-10 14:51:26.0
Engineering,Maintenance,Production,Research and Development
Career Center | chennai, India | Production
i also working in smt operator an 6 mounth.so,i am searching better for my working company.my smt knowledge is operating on printer,pick&place and also reflow and wave soldring.i am operate at full function an the smt machine and i know the all smt c
Imagineering, Inc. | https://www.pcbnet.com/blog/canadian-importer-and-marketer-of-aerosol-product-used-to-clean-printed-circuit-boards-is-fined-265000/
Canadian Importer and Marketer of Aerosol Product Used to Clean Printed Circuit Boards Is Fined $265,000 | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1369&OB=DESC.html
: Double Click on any object auto-opens the Properties Dialog Window FIXED / ENHANCED: Expedition: Fixed various output issues having to do with the translation of Polygons Various naming issues when using the PADS Importer PADS to CAD Translator
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