Industry Directory | Manufacturer
Economical machines for marking component parts with ink imprints.
Industry Directory | Distributor
Supplies precision marking machines & systems for single & multi-color imprints, cycle times 300 - 3
New Equipment | Cable & Wire Harness Equipment
Overview The HotStamp 4140 is designed for economical high quality marking of wires, cables and tubing. Character combinations and character sizes are freely selectable. Although primarily used for marking wires and cables, the HotStamp 4140 is sui
Electronics Forum | Wed Apr 28 13:33:48 EDT 2004 | Rob
Thanks to all. The way I've been doing it has been crude and very similar to your method. I make an imprint of the bottom side and cut out areas where components sit and this imprint transfers over to a cardboard. When it comes time to run the second
Electronics Forum | Wed Jul 25 09:21:44 EDT 2001 | Stefan Witte
Dave is right that this site has several leads on 0402 placements and tombstoning issues. However, I found a new method of determining the pick position. Remove a component and fill the cavity with silly putty. After attempted pick up you should see
Industry News | 2011-02-05 13:58:33.0
The Annual Pan Pacific Microelectronics Symposium & Exhibition that took place January 18-20, 2011, at the Hapuna Beach Prince Hotel, on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.
Industry News | 2022-11-22 06:14:08.0
Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
Technical Library | 2020-09-30 19:23:47.0
There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other smart devices. The applications can be lens bonding, waveguide imprinting, or other applications where the adhesive is in the optical pathway. To support these various optical applications, new materials with tailorable optical properties are required. There is often a mismatched refractive index between plastic lenses such as PC (Poly Carbonate), COP (Cyclo Olefin Polymer), COC (Cyclo Olefin Copolymer), PMMA (Poly Methyl Methacrylate), and UV curable liquid adhesive. A UV curable liquid adhesive is needed where you can alter the refractive index from 1.470 to 1.730, and maintain high optical performance as yellowness index, haze, and transmittance. This wide range of refractive index possibilities provides optimized optical design. Using particular plastic lens must consider how chemical attack is occurring during the process. Another consideration is that before the UV curable liquid adhesive is cured, chemical raw component can attack the plastic lens which then cracks and delaminates. We will also show engineering and reliability data which defined root cause and provided how optical performance is maintained under different reliability conditions.
