Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification / Training Provider
Blackfox is the industry leader in providing IPC Certifications, Solder Training, Customized Training Programs, and Counterfeit Component Training and Certification.
Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
New Equipment | Solder Materials
Solder dross has gone from being a cost to be considered by large companies to a very high cost that must be tracked for all who assemble electronic devices.As much as 70% of bar solder can be wasted as solder dross and with SAC 305 now at the $25/Lb
Electronics Forum | Mon Aug 27 10:23:41 EDT 2012 | cobham1
I need to clarify something for everyone. The end customer is the Military. Our customers are military suppliers who do in fact have quality systems in place. When we build the product we end up potting the unit so the customer never looks at the ele
Electronics Forum | Mon Aug 27 08:57:39 EDT 2012 | cobham1
We are not a contract manufacturer we are in fact a OEM. our product is used for military systems. The reason no values are on the parts is because the orginal owner of the product did not want anyone to steal the values and make their own version of
Used SMT Equipment | Pick and Place/Feeders
Product name: KE - 3010ACL high-speed chipmounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed highquality electric production line of
Used SMT Equipment | SMT Equipment
Product name: KE – 3010ACL high-speed chip mounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed high quality electric production line of f
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Parts & Supplies | Solder Paste Mixers
Solder Paste chambrieren machine,solder Paste softening machine Description: Brand name:solder Paste chambrieren machine Type:4 slot Material:Hot steel spraying Power supply:220V(50Hz) Power:0.4Mpa Original:Shenzhen Weight:20KG Advantage:
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-09-16 06:27:24.0
Vacuum reflow ovens are the best way to solder SMD components. They create a controlled environment that prevents oxidation and improves solder joint quality.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 4+years of experience in SMT process engineering, specializing in solder related issues. Strong experience with solder paste, reflow wave solder, etc. Duties/Finctions: Provide expertise to SMT processes through solder process en
Career Center | Los Angeles, California USA | Engineering
AOI Automated Test Equipment. Application and Process Engineer. Specialize in the technical aspects of all electronics industries. Specialize in all various products Operates all products such as reflow oven, KIC System, Hioki Testers, Saki AOI S
Career Center | Brookfield, ALL USA | Management,Production
Training and Qualifications Mil standards 464 Mil Standards 2000 ESD Training Cellular Manufacturing TQM Totally Quality Manufacturing ISO 9000 and 9001 IPC Standards, IPCA-610 IPC-J-STD-001E OSHA training LEAN Manufacturing, JIT (Just In T
Career Center | , | 2011-11-16 09:17:11.0
Mil standards 464, Mil Standards 2000, ESD Training, Cellular Manufacturing, TQM Totally Quality Manufacturing, ISO 9000 and 9001 IPC Standards, IPCA-610, IPC-J-STD-001E, OSHA training, LEAN Manufacturing, JIT (Just In Time) Six Sigma, AS400 Systems
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page Solder Paste Measurement: A Yield Improvement Strategy That Helps Improve Profits by Mike Riddle , ASC
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
