Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification / Training Provider
Blackfox is the industry leader in providing IPC Certifications, Solder Training, Customized Training Programs, and Counterfeit Component Training and Certification.
Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Electronics Forum | Thu Jun 13 09:22:17 EDT 2002 | myfloh
Hi, I would like to have information about means to improve the stability of a SMD-Line: indeed the variation of the daily performance is too important (between 50 and 250 ppm). What is the solution to reduce these variations? climatisation, other re
Electronics Forum | Fri Jun 14 20:46:40 EDT 2002 | kenbliss
Dave, you are ahead of me again. I was thinking that this morning. however it clearly is a problem for him and I based the rest on my experience, anything can be improved but at what cost. If nothing else he can get more boards off his line at the
Used SMT Equipment | SMT Equipment
Samsung SM471 mounter Product Name: Samsung SM471 high speed chip mounter Product number: SM471 Detailed product introduction Samsung SM471 high speed chip mounter r parameters High speed Chip machine SM471 is each mount head with 10 shaft an
Used SMT Equipment | Pick and Place/Feeders
Product number: JUKI - JX350 Product details: JUKI JX - 350 long base board high-speed chipmounter Features: Chip components 32000 CPH (best conditions) Element size Laser recognition: 0603 ~ 33.5 mm squareelement length Laser mount head * 1
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Parts & Supplies | SMT Equipment
Improved wiping strip steel mesh(10100050224） Improved wiping strip steel mesh(10100050224 Kindly contact me if you are interested. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 0086-13170471806
Parts & Supplies | SMT Equipment
Improved wiping strip steel mesh(10100050224） Improved wiping strip steel mesh(10100050224 if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: ali
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-08-16 18:25:16.0
In one of our Consumer Electronics projects, a leader of networking technologies requested to test dispensing performance of a thermally conductive material, Fujipoly Sarcon SPG-50A. This material improves heat dissipation for higher frequency applications and reduces the negative effects of thermal resistance under heat, cold, humid, and thermal shock conditions. The customer's goal was to dispense a 1mm diameter dot with acceptable speed and consistency.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)
Career Center | Austin, Texas USA | Engineering,Production
Requirements: � Provides engineering solutions for cost effective and efficient operations while using compliant change control procedures. Responsible for investigate and manage improvement costs, communicate changes, and reporting performance. �
Career Center | Blackwood, New Jersey USA | Production
Responsibilities include the following: Improve the cost effectiveness, efficiency, and quality of production processes. Develop methods, practices, and processes used to manufacture circuit assemblies. Program Surface Mount Equipment for printed ci
Career Center | , Honduras | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Several years working as a Mechatronic engineer in the field of automotive industry. I have worked on projects that included new product design and development, manufacturing processes, assembly lines, Continuous Improvement, quality improvement, fac
Career Center | Dasmarinas, Philippines | Sales/Marketing
an experienced sales and marketing professional with strong background in SMT production process
| http://etasmt.com/cc?ID=te_news_industry,26567&url=_print
. Each component points to an aspect of the process that can be targeted for improvement. OEE may be applied to any individual work center, or rolled up to department or plant levels
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/abstract_form.cfm
: Process Improvement Reliability/Quality Improvement New Technology Cost Reduction * Describe the Project or Process (250 words max.) * Is the research and/or process development completed
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