Industry Directory | Consultant / Service Provider
A software company designed to improve efficiency and utilization from database collection points.
New Equipment | Assembly Services
Trade name: Siemens feeder calibrator Weight: About 35kg Product size (mm): L500 * W350 * H500 Calibration mode: Electric Applicable model: Siemens D series (not applicable, X series is contactless power supply, D series is plug-in terminal) Pur
KSUN R05 JUKI Feeder Calibration It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of device pos
Electronics Forum | Mon Aug 06 16:33:52 EDT 2018 | tey422
If I understand customer's intention correctly, it would be fastest, mass production with fully utilizing the Pick-N-Place machine capacity with minimum manual labor which won't break the bank. They used to manual hand soldering the coil to the boar
Electronics Forum | Fri Aug 13 09:49:57 EDT 2004 | russ
What are you measuring? Actual placement speed vs. rated speed? Machine down time? A lot of this depends on your type of enviroment. If you build high mix/low quantity/prototype your numbers will be very low and will vary depending on the complex
Used SMT Equipment | SMT Equipment
Product name: KD - 775 JUKI chip mounter Product number: KD - 775 Products in detail JUKI KD775 high-speed daub glue standard equipped with three dispensing head, achieved 0.1 seconds/launch daub adhesive at a high speed. Stable quality stand
Used SMT Equipment | Pick and Place/Feeders
Product number: KD - 775 Products in detail JUKI KD775 high-speed daub glue standardequipped with three dispensing head, achieved 0.1 seconds/launch daub adhesiveat a high speed. Stable quality standards are equipped witheven daub glue residual wi
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2023-04-19 17:43:01.0
As spring blossoms arrive and everything comes to life, HELLER Shanghai continues to grow and expand its capabilities in R&D, manufacturing, and customer support. In order to better serve its customers in China and around the world, and to meet future challenges and opportunities, HELLER China has moved to a new location after 21 years at their previous facilities in Shanghai.
Parts & Supplies | Pick and Place/Feeders
GIC-F01 FUJI NXT Feeder Calibration JIG It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of
Parts & Supplies | Pick and Place/Feeders
GIC-Y01 YAMAHA Feeder Calibration JIG It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of de
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2022-06-27 17:04:51.0
In today's Electronics Manufacturing Industry, standards for defect and quality control are stricter than ever due to advancements of electronic products and increasing safety and environmental regulations. Electronics Manufacturers are forced to maximize their production efficiency by implementing lean manufacturing initiatives and optimizing production processes. With this in mind, manufacturers are relying upon Automated Optical Inspection (AOI) equipment to streamline the manufacturing process and provide real time root cause analysis of manufacturing defects. The objective is to increase profitability by improving production yields and reducing costly rework.
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
Hand-Held Reel Rolling machine can collection and discharge automatically replace the manual, it's convenient, fast, and improve the working efficiency.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA
Wafer-Level Packaging Symposium
Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA
Wafer-Level Packaging Symposium
Career Center | Providence, Rhode Island USA | Production
Manufacturing Supervisor for an electronic & electro-mechanical assembly, test, and packaging operation. ISO9001 company. Establish & maintain production schedules, improve efficiency & reduce cycle time, manage & develop staff.
Career Center | Blackwood, New Jersey USA | Production
Responsibilities include the following: Improve the cost effectiveness, efficiency, and quality of production processes. Develop methods, practices, and processes used to manufacture circuit assemblies. Program Surface Mount Equipment for printed ci
Career Center | Fort Worth, Texas USA | Production,Technical Support
21 Years SMT experience proficient in ASM (Siemens) Si-place technology.
Career Center | Saginaw, Texas USA | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Management Experience: Over 5.5 Years Managing Production, Test, Warehouse, and Process Engneering, while improving overall Quality and Efficience Project Management Experience: Managed Various Cost Reduction projects using Lean Manu
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/products/liquid-paint-spray-nozzles?con=t&page=5
& Paint Spray Nozzles Nordson's comprehensive range of standard and speciality nozzles reduce rejects and increase efficiencies in liquid or paint spray applications
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
] Devices manufactured at and below the 7nm node are no longer achieving the same energy efficiencies of scale as older nodes [4] and are therefore driving the increasing overall heat flux [Fig. 2]. D.W
