Industry Directory | Consultant / Service Provider
An independent solder analysis lab. Our services include solder analysis of wave solder machines and solder pots. We test for impurities based on J-STD-006B for most tin and lead based alloys.
Industry Directory | Manufacturer / Manufacturer's Representative
Hiflo Solders Private Ltd (HSPL) , was established in the early nineties and has grown into a business enterprise in manufacturing and marketing of Solders, Fluxes, Cleaners, Anodes, Soldering Accessories for the domestic & inte
New Equipment | Soldering Robots
ERSA POWERFLOW Wave Soldeing Machine Solder volume: 820 kg working width: 508 mm Weight: 2,200 bis 3,000 kg Dimension: 4,200 to 4,950x1,510x1,565 mm ERSA POWERFLOW Wave Soldeing Machine ERSA POWERFLOW Wave Soldeing Machine ERSA POWERFLOW Wa
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Durostone® Solder pallets Durostone® Solder pallets - perfectly machined A good example to show the precision of our machining are Durostone® PCB solder pallets. They are used to fix electronic components on printed circuit boads using the wave sold
Electronics Forum | Fri Jan 16 15:31:26 EST 2004 | davef
Bill This drives solder suppliers nuts, because it's not analytic: Dross inclusion testing can be conducted on the base solder in the solder pot and the virgin solder. Conduct this test by heating a sample of solder, contained in a clear beaker,
Electronics Forum | Tue Jan 13 12:02:38 EST 2004 | blnorman
We're changing solder bar and wire suppliers and are running impurity tests. Is there an IPC standard that lists acceptable limits for ultra pure, pure, solders for metallic and non-metallic impurities? What is the preferred method to test? We've
Used SMT Equipment | Soldering - Wave
400V 50/60 HZ Version ERSAsoft for: 4.050.000.000 2. Operating System Dell / Windows 7 Processor: Pentium(R) Dual Core E5800 @ 3.20GHz 3.19GHz Memory RAM: 4.00 GB (3.46 GB usable) 320bit Operating System Touch Screen – No Pen Touch, input is availabl
Used SMT Equipment | Soldering - Selective
Options: • Less than 100 hours of operation • Top side pre-heat • DC servo drives • Integral PC and machine mounted TFT monitor • Inerted Nitrogen system • Auto motorized wire solder feed & level detect • Solder bath coding – ide
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2012-10-05 16:48:23.0
IPC — Association Connecting Electronics Industries® announces that Jasbir Bath of Bath and Associates Consultancy LLC, has joined the staff on a project basis as a principal engineer within IPC’s assembly technology area.
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Ultra-flexible, offline, multi-platform selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Pro offers the ability to regularly change solder alloys witho
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
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Heller Industries Inc. | https://hellerindustries.com/dull-solder-joints/
. Process and design-related causes of Dull Solder Joints: Impurity in the component plating Impurity in the circuit board finish Bad or expired solder paste Reflow-related causes of dull solder joints
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