Industry Directory | Manufacturer / Other
Manufacturer of Hydraulic Vacuum Lamination Presses
Industry Directory | Manufacturer
SMAC pick & place actuators are unique as they enable total programmability of speed, position and force all at the same time. SMAC's "Soft-Land" function prevents chip fracture.
Count On Tools specializes in custom engineered nozzles for all types of LEDs (Cree, Luxeon, Phillips, NIchia, Osram, etc). Recent growth in LED technology and solid state lighting has provided the electronics manufacturing industry with viable sol
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
Electronics Forum | Fri May 14 16:49:17 EDT 2021 | winston_one
Agree with WiIIR and also can recommend to play with vaccum pump RPM . Slower vacuum increasing have help me to resolve one problem caused by the vacuum (it was solder splash from BGA balls, but the reason can be similar to your case). Also check i
Electronics Forum | Fri Jan 19 05:46:59 EST 2018 | ivammendes
MYDATA MY9E: Hydra's pipe can't stop the vacuum during assembly. The problem ocurre just in only one pipe, the number 5. The tool picks components but doesn't drop it. Can the problem be in the unit vacuum?
Used SMT Equipment | Screen Printers
DEK 03iX Specs: • Process alignment capability 2 Cpk @ ± 25µm 6-Sigma • Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma • 12 second cycle time • High Throughput Conveyor (option) , enables core cycle time reduction to just 11 seconds • DE
Used SMT Equipment | THT Equipment
JUKI JM 50 Insertion Solution THT JUKI JM 50 Insertion Solution THT Lowest cost JUKI's JM-50 convinces with lowest entry costs for THT production when producing high-mix low-volume. Recognition of various component heights The new "Takumi head" has
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2003-03-25 09:15:19.0
The Dragon was demonstrated at the CPCA show in Shanghai last week
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Parts & Supplies | Pick and Place/Feeders
1.philips smt nozzle nafcm1 philips smt nozzle 0.88mmx0.50mm(custom) 946602747001 0.95mm×0.55mm(pa2747/00) 946602747201 1.3mm×0.88mm(pa2747/20) 946602747301 2.5mm×1.5mm(pa2747/30)nz. 2.philips topaz-x smt nozzle 5322 360 10
Parts & Supplies | Pick and Place/Feeders
Hydra miniature solenoid vacuum valve using for repairing Hydra vacuum unit L-012-0609 for Mycronic-Mydata MY9-19, MY100, MY200, MY300 machines. New. Unit sales. Available in stock View this part on LandrySMT web site: https://www.landrysmt.fr/p
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Events Calendar | Wed Jun 27 00:00:00 EDT 2018 - Thu Jun 28 00:00:00 EDT 2018 | San Jose, California USA
Sensors West
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Battery Show
Career Center | Buford, Georgia USA | Technical Support
Over 9 years of Assembleon Electronic Manufacturing Equipment training and support. Primary machine experience: FCM I, II, and Multi-Flex, ACM Micro and AX. Dedicated CTT+ Certified Training Professional. Experienced in Instructor-led training an
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
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ASCEN Technology | https://www.ascen.ltd/Video_Channel/PCB_conveyor_system/138.html
LED board vacuum suction loader-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb buffer conveyor from ASCEN technology Welcome to visit ASCEN | | | | | | | Cart
