Industry Directory | Manufacturer
Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.
Industry Directory | Manufacturer
Manufacturer of indium-based specialty metals and chemicals
New Equipment | Solder Materials
5N Plus produces indium in pure metal, chemical and low melting point alloy forms for use in electronics, solar cells and optics. Indium is essential in forming transparent electrodes from indium tin oxide (ITO) in liquid crystal displays (LCD) and t
Electronics Forum | Tue Jun 27 11:42:54 EDT 2006 | rkevin
What is up with Indium 5.1 lately. Has Indium lost the recipe. The Lead free products from Indium used to kick ass, now they are biting mine. I'm looking at Aim 254 and Senju
Electronics Forum | Thu Oct 27 13:25:12 EDT 2005 | bobpan
indium gets my vote
Used SMT Equipment | Soldering - Wave
Electrovert Econopak Plus Lead Free Wave Solder; Model: EPK+ 400/F; SN: MO940811001; Date: 10/1994; 440VAC 3-Phase 32.9 KVA; Full of Indium Sn95.5Ag3.8Cu7 Lead Free Solder; Chip & Lambda Wave; (2) Bottom Side I/R Preheaters; (1) Topside I/R Preheater
Industry News | 2009-09-26 15:37:45.0
Barry O’Brien died on Sunday, September 20, 2009 while bike riding. Barry covered the Ohio territory for Horizon Sales, a manufacturer’s representative corporation supplying machinery and supplies to the electronics industry.
Industry News | 2013-10-15 18:26:54.0
IPC – Association Connecting Electronics Industries® awarded the first IPC J-STD-004 Qualified Products Listing (QPL) certificate to Indium Corporation’s Clinton, N.Y., USA facility.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
Professor Ron Lasky, Ph.D., Phil Zarrow, and Jim Hall discuss the SMT Processes Certification offered by SMTA. http://www.smta.org/certification/ Video production courtesy of Indium Corporation.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA
San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components
Events Calendar | Wed Jun 07 00:00:00 EDT 2023 - Wed Jun 07 00:00:00 EDT 2023 | Indianapolis, Indiana USA
Indiana Chapter Technical Presentation and Networking Event: Batteries, Baseball & Beer
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
Surface Mount Technology Association (SMTA) | https://www.smta.org/certification/certified_engineers.cfm
. Eric Bastow, Indium Corporation Romel Bataluna, Jennifer Batt, L-3 Communications Telemetry-West Thomas Bauer, PRIDE Industries Edgar Bautista, Cisco Systems Octavio Bejarano, Cisco Systems Dennis
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
) Processes for Emerging Heterogeneous Integrated Packages Abstract— Reflowed indium metal has for decades been the standard for solder thermal interface materials
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