New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Electronics Forum | Tue Apr 05 15:06:51 EDT 2011 | remullis
I am currently running at 2.12 minutes TAL using Indium 8.9HF. I am up to 68/cm min in a 8 zone oven. Indium recommends 30-100 sec or .30 to 1.40 minutes, I am think of increasing the conveyor speed until I fall with the 1.40 minutes, does anyone hav
Electronics Forum | Wed Apr 22 23:25:15 EDT 2009 | jandon
We were using AIM WS485 SAC305 and AIM NC257 SAC305 and we had problems with voiding and AIM�s narrow process windows. Now we are using Indium3.2 and Indium8.9 with much better results.
Industry News | 2015-10-27 22:08:05.0
Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.
Industry News | 2015-11-14 15:34:42.0
Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany
SMTnet Express, February 9, 2017, Subscribers: 30,132, Companies: 15,113, Users: 41,841 Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue? Eric Bastow; Indium Corporation The SMT assembly world
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