Industry Directory | Manufacturer
Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.
Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
New Equipment | Solder Paste Stencils
Semi Auto SMT PCB Solder Paste Printing Machine Model 500mm 800mm 1200mm 1500mm Direction Left → Right, Right → Left Power Single phase 220V, 50/60Hz,100W Translational speed 0-2200mm/mins
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
Electronics Forum | Tue Apr 13 08:08:33 EDT 1999 | Rob Palson
We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to bu
Electronics Forum | Thu Aug 29 20:02:58 EDT 2002 | davef
Often assemblers leave areas unsoldered for future component additions, modifications, and test points. On imm silver boards, these unsoldered areas become a real bear to solder/test later in life. One way to avoid that problem is deposit some solder
Used SMT Equipment | Soldering - Wave
Electrovert Econopak Plus Lead Free Wave Solder; Model: EPK+ 400/F; SN: MO940811001; Date: 10/1994; 440VAC 3-Phase 32.9 KVA; Full of Indium Sn95.5Ag3.8Cu7 Lead Free Solder; Chip & Lambda Wave; (2) Bottom Side I/R Preheaters; (1) Topside I/R Preheater
Used SMT Equipment | Adhesive Dispensers
Features 1. Uses the high accuracy timing control electric circuit to guarantee dispensing evenly. 2. .Have vacuum Suck-back ensures no dripping. 3. Operation simple, Adjustment and replacement mold is easily. 4. Based on the size of oval
Industry News | 2011-04-22 21:36:56.0
GPD Global announces that its MAX Series Dispensing Systems are the dispensers of choice for high accuracy and repeatability applications.
Industry News | 2011-08-30 19:41:37.0
The SMTA announced two sessions on Alternate Lead-Free Alloys featured during their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Parts & Supplies | Circuit Board Assembly Products
1). Material CEM-3, FR-1 2). Double sided, 1.6mm, 1oz 3). Silver through hole 4). Green solder mask/white silk screen 5). OSP finish 6). Punch contour/cnc rout
Parts & Supplies | Circuit Board Assembly Products
PULANG TECHNOLOGY CO,.LTDOffers electronic manufacturing services including PCB designing, electronic contract manufacturing including electronic product design, electronic product development, electronic product repair, PCB manufacturing, electronic
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
RCM-H1000D series Desktop automatic centrifugal mixer-temperature recovery type One.piece use clause H1000D desktop automatic centrifugal mixer is based on current technology and safety standards: GB4793.1-2007 "Safety requirements for electrical eq
This is what the fully assembled How to Solder Kit looks like. Depress the button and one of the LEDs will remain lit at the end (it eventually times out). You can add some kind of template so each LED position has some meaning. The PCB has a real gr
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA
San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
GPD Global | https://www.gpd-global.com/silver-ink-dispensing.php
Silver Ink Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/silver-epoxy?page=2
pump is an encoded auger pump with a floating head designed to make fast, repeatable dots of solder pastes, silver epoxies, and surface mount adhesives Valve - DV-8000C Heli-Flow Pump Nordson
