World leader in Induction Technology Melting, Heating & Welding equipment manufacrurer
Industry Directory | Manufacturer
Developer and Manufacturer of inductive components and power supplies for Lighting/Industrial/professional/medical/consumer applications
Panasonic Plug machine induction LEVER 102030802503 Sales: Becky Su MP:86-15323874439 Email: becky@hysmt.cn beckysusmt@hotmail.com Skype: beckysmt Website: www.smt-cn.com
Panasonic Plug machine induction LEVER 102030802503 Sales: Becky Su MP:86-15323874439 Email: becky@hysmt.cn beckysusmt@hotmail.com Skype: beckysmt Website: www.smt-cn.com
Electronics Forum | Tue Apr 04 02:51:41 EDT 2006 | arnold
Hi everyone, can you tel me on how to compute (mathematically)the inductance of transformer having having gap core. what i know is inductance for ungapped core L = Al value of core x square the no. of turns how about for gapped core
Electronics Forum | Fri Dec 20 10:13:38 EST 2002 | davef
The total inductance of a chip capacitor is determined both by its length to width ratio and by the mutual inductance coupling between its electrodes. So, a 1210 chip size has a lower inductance than a 1206 chip. Check with your supplier for recomm
Used SMT Equipment | Pick and Place/Feeders
Samsung SM421S automatic multi-function placement machine Mounting speed -Chip 21K CPH (IPC9850) -QFP 6K CPH (IPC9850) Volume should be components -Max. 0402 ~ □55mm(Part height H=15mm) Placement accuracy -±50@μ+ 3σ/Chip -&pl
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Industry News | 2003-01-24 09:07:53.0
For Industrial, Telecom and Datacom Use
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Technical Library | 2008-09-04 17:57:24.0
In the quest for lower ESL devices, having the ESL reduced in the package is only half of the battle; connecting that device to the circuit determines how much of that low ESL appears to the circuit. For this low ESL part type, it would be a shame to take a part of 200 pH and add 2000 pH to its ESL because of via patterns on the PCB.
Technical Library | 2015-02-05 23:23:40.0
Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today's high pin count, high frequency integrated circuits. However, that same pin density and unique interface create a challenge unique unto themselves. These challenges need to be faced head on since the ball grid array (BGA) is prevalent in modern PCBs. While there are entire textbooks that cover the topic of BGAs, their use and fanout techniques, the quick overview provided here offers an engineer a good starting point for improving BGA designs.
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
Career Center | BIDDEFORD, Maine USA | Engineering,Maintenance
Searching for a Facilities Engineer with a strong Mechanical and/or Industrial background. Experience facilitating the design of machinery and equipment in a fast paced environment required. Strong knowledge of facilities and building maintenance a
Career Center | Chandler, Arizona USA | Technical Support
Koh Young America is looking for technical field application engineers to support our world class electronics 3D measurement and inspection products. This a dynamic position and will require skills to handle both technical pre-sales activities, s
Career Center | Farrukh Hussain, Pakistan | Engineering,Maintenance
PLC, SCADA, designing circuit or PCB layout, troubleshooting and maintenance, electrical and instrumentation, electronics design, software skill with programming.
Career Center | Karachi, Pakistan | Engineering,Maintenance
PLC, SCADA, designing circuit or PCB layout, troubleshooting and maintenance, electrical and instrumentation, electronics design, software skill with programming.
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