Electronics Forum | Fri Dec 01 12:56:33 EST 2017 | emeto
It seems that it will work with 5 mil stencil. To be safe use 4 mil if the rest of the design allows it. 10x20mil apertures for both rows. If you have bigger footprint in the corners, make bigger apertures there. For the ground plane, I would use ver
Electronics Forum | Mon Sep 21 07:47:31 EDT 2015 | koprivecj
Greetings! I have a problem with PAD connection in inner layers of 4 layer PCB (signal1, GND, POWER, signal2). Sometimes there is no connection between pad and power plane. I'm using termal relief around PAD in inner layers (same shape pad trough who
Industry News | 2018-10-18 11:15:12.0
PCB Design and Layout Guidelines
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
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Parts & Supplies | Pick and Place/Feeders
YAMAHA CL 24MM feeder reel inner cover Other yamaha parts: YAMAHA CL24mm Parts List Part No. Part Name KW1-M452D-000 COIL SPRING KW1-M221F-100 STOPPER PIN K87-M211B-000 BACK STOPPER AXIS KW1-M4521-000 METAL KW1-M4523-000 SPROCKET KW1-
Parts & Supplies | Pick and Place/Feeders
Samsung SM421 Z servo motor MMMA3ACN2A Other Samsung parts: J7253006A IDLER 1 J2101816 IDLER SPACER-S [0135-641103] J7253007A IDLER 2 J2101819 IDLER SHAFT-M [0135-641106] J6708016A AIR FILTER[AF40-04BC] J6701028A AIR CYLINDER [BDAS6*15-CS11T-
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
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ASCEN Technology | https://www.ascen.ltd/Blog/machines/list_31_27.html
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| https://www.eptac.com/faqs/ask-helena-leo/ask/75-barrel-fill-requirement-for-class-2-change-in-j-std-001-revision-f
: Why did the IPC change the barrel fill requirement for Class 2 in J-STD-001 Revision F? Revision E allowed 50% when there was a thermal plane. Now, Rev. F states 75
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