Industry News | 2013-03-18 10:28:43.0
SEHO Systems GmbH,will highlight several machines in hall 9, stand 209 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components With PCB complexity and density increasing and also
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
. About the Presenter: Francy Akkara is pursuing his doctoral degree in Industrial and Systems Engineering at Auburn University. He has been working on electronics reliability for the past four years with focus on component reliability in thermal cycling