Industry Directory | Manufacturer
Shenzhen Haoda Technology Co., Ltd established in 2000 and headquartered in Shenzhen, has become a provincial level Hi-tech Enterprise in Guangdong Province with the product range from single sided to high-density multi-layer PCB.
ProntoTEST-FIXTURE used by electronics manufacturers will accurately setup your Automatic Test Equipment (ATE), Flying Probe and design your "bed of nails" test fixturing. In minutes Unisoft ProntoTEST-FIXTURE software translates CAD and Bill of Ma
TEXAS INSTRUMENTS 2493619-0001 ADAPTER BASE TEXAS INSTRUMENTS 305-25N 115VAC INPUT TEXAS INSTRUMENTS 560-2124 120VAC CHASSIS TEXAS INSTRUMENTS 0943679-0001 PWR SUPPLY 960B TEXAS INSTRUMENTS 0983801-0003 SILENT 700 TERM TEXAS INSTRUMENTS
Electronics Forum | Thu Feb 20 20:22:23 EST 2014 | bkendall421
Universal Instruments AC30L. Rated at over 30k CPH but dependent on mix you will realize between 18k and 24k CPH REAL speeds. Very flexible with feeder cart swapping. Wide component mix. American made and the best support of any p&p company. Sounds
Electronics Forum | Fri Oct 03 10:52:32 EDT 2014 | rgduval
Thanks for the suggestion, Arifa. However, it doesn't look like any of these are for the Universal Instruments GSM2 pick and place machine. The Keller-Druck link is for a GPRS Modem with a datalogger. The Sparkfun and Cybrotech sites seem to be
Used SMT Equipment | Pick and Place/Feeders
Universal 4796L-0-10519 SMT Pick & Place Equip No: 10042900 Product Tree No: 47890501 Dimensions: 236" x 83" x 85" Item Location: Boston, MA USA
Used SMT Equipment | Pick and Place/Feeders
Seller will consider all reasonable offers Please Visit link for details (1) Universal GSM 2 SMT Pick & Place Machine * reference lot 2 in this auction for more details * (2) Lots of Universal SMT Feeders * reference lots 3 & 4 in this auction f
Industry News | 2021-11-17 09:28:16.0
Baja Bid is hosting an online auction event featuring surplus equipment from CASE Assembly. Universal Instruments, DEK, Heller and much more. The bidding period will begin closing today at 1pm EST.
Industry News | 2014-05-12 16:06:39.0
SMTA China announces that it presented awards for nine papers at the SMTA China East 2014 Conference Award Presentation Ceremony, held on Wednesday, April 23, 2014 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Parts & Supplies | Pick and Place/Feeders
Standard: L500*W350*H550MM Brand: UNIVERSAL
Parts & Supplies | Pick and Place/Feeders
We sale SMT machines and spare parts in many brands. Such as Samsung, Yamaha, Fuji, Juki ect. If you have any inquiry, please feel free to contact us!
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
Technical Library | 2014-10-30 01:48:43.0
The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed amplitudes, or random vibration testing, alone. Effects of thermal cycling enhanced precipitate coarsening on the deformation properties can be accounted for by microstructurally adaptive constitutive relations, but separate effects on the rate of recrystallization lead to a break-down in common damage accumulation laws such as Miner's rule. Isothermal cycling of individual solder joints revealed additional effects of amplitude variations on the deformation properties that cannot currently be accounted for directly. We propose a practical modification to Miner's rule for solder failure to circumvent this problem. Testing of individual solder pads, eliminating effects of the solder properties, still showed variations in cycling amplitude to systematically reduce subsequent acceleration factors for solder pad cratering. General trends, anticipated consequences and remaining research needs are discussed
Make: Universal Instruments Model: Genesis GX-11 Vintage: 2014 Details: Software Version 6.08 Head Assembly: Inline 4 Genesis 1M/P PEC Camera Removable Feeder Bank Assembly Magellen 2.3MPP Camera NPI Mode Left to Right Board Transport 3MM Cleara
The industrial chain of laser processing has formed a complete ecological chain of laser processing from enterprises producing core lasers upstream to enterprises producing various kinds of laser processing equipment and then to enterprises providing
Career Center | Karachi, Pakistan | Engineering,Maintenance,Research and Development,Sales/Marketing,Technical Support
• Experienced in SMT Production, working on Siplace X Series-S and DEK-Micron Printer, on Siplace Pro and Siplace Explorer. • Having Strongly Skills of calibration of SMT machine, twin head, Multi star head, speed star head, gentry, Nozzles, feeders,
Career Center | CHENNAI, India | Engineering
As an Instrumentation engineer, I have interest in automtion for that i have done a course on PLC and SCADA. Apart from that I also attended workshops on PCB and EMBEDDED. Since I am 2018 passed out, I have no job experience.
SMTnet Express, August 21, 2014, Subscribers: 23101, Members: Companies: 13997, Users: 36681 Ready to Start Measuring PCB Warpage during Reflow? Why and How to Use the New IPC-9641 Standard. Ken Chiavone; Akrometrix. Understanding warpage
SMTnet Express, January 23, 2014, Subscribers: 26486, Members: Companies: 13559, Users: 35667 Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu by Martin K. Anselm, Ph.D. and Brian Roggeman; Universal Instruments Corp
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-receives-recognition-from-the-asian-electronics-industry-for-the-4000-optima-bondtester
– Functional Test 2014 EM Asia Innovation Award in the category - Test Instruments The 4000 Optima Bondtester delivers unrivalled performance, to meet and exceed test standards, combined with ultimate
Baja Bid | https://bajabid.com/november-11-17-2021-smt-auction/
. Location, South Easton, MA USA Items Including – 2010 Heller 1707 MKIII Reflow Oven, 2014 Heller 1707 MKIII Reflow Oven, [3] Ekra E4 Screen Printers, [2
