272 instruments 20in 20try 2feeder results

Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs

SMTnet Express - June 12, 2014

SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering