SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering
,Texas Instruments Inc., Dallas, TX ABSTRACT Minor voiding in
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. It kind of leads on better as the footprint name tells me from the beginning that it's a standard package, the size, then at the end that it's a Texas Instruments or Analog Devices variant
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