Industry Directory | Manufacturer / Manufacturer's Representative
Shenzhen PCB ELECTRONICS LTD, founded in 2006, is a proficient PCB&PCBA manufacturer as a National High-Tech Enterprise. Based on our PCB factory in Huizhou, Guangdong, we produce 1-40L PCB precisely and densely. Along with our 6
Industry Directory | Manufacturer
Pemtron develops and manufactures 3-D Solder Paste Inspection, 3-D Nano Profilers and Scanning Electron Microscopes
Fisher Control Valves & Regulators Fisher Products process control valves, digital valve controllers, pressure regulators and field automation systems Fisher,Emerson Process Management,Valves,Control Valves,Actuators,Process Instruments,Instrumentati
Electronics Forum | Thu Aug 19 11:58:12 EDT 2010 | davef
From "Universal Instruments Packaging Specification" ... [snip] Packing Of Populated Boards · These parts require individual separation and protection to prevent electro static discharge and structural damage. They shall be packed in sealed, anti-st
Electronics Forum | Wed Feb 02 12:11:31 EST 2000 | Dave F
Casimir: Resistivity of Solvent Extract (ROSE) testers measure ionic contamination by washing boards with a DI water/IPA solution. (No-clean people: Stop and go on to something else.) The testers are process control instruments used to monitor a
Industry News | 2003-05-29 08:13:34.0
Universal Instruments and Asymtek have formed a partnership that will place an Asymtek Millennium 2020 dispenser in Universal's new Technology Excellence Centre in Suzhou, China.
Industry News | 2008-04-29 23:10:39.0
Richardson, TX (April 29, 2008) ASSET� InterTech Inc. (www.asset-intertech.com) is developing and will bring to market open embedded instrumentation tools based on the preliminary IEEE standard, P1687 Internal JTAG (IJTAG). According to Glenn Woppman, president and CEO of ASSET, the standard is close enough to ratification to begin developing tools.
Parts & Supplies | Repair/Rework
Repair parts include: CPU circuit board repair and maintenance of the I / O board, servo circuit board repair, the image processing circuit board repair, industrial CCD camera repair, frequency converter repair, PLC repair, touch screen repair, laser
Technical Library | 2014-10-30 01:48:43.0
The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed amplitudes, or random vibration testing, alone. Effects of thermal cycling enhanced precipitate coarsening on the deformation properties can be accounted for by microstructurally adaptive constitutive relations, but separate effects on the rate of recrystallization lead to a break-down in common damage accumulation laws such as Miner's rule. Isothermal cycling of individual solder joints revealed additional effects of amplitude variations on the deformation properties that cannot currently be accounted for directly. We propose a practical modification to Miner's rule for solder failure to circumvent this problem. Testing of individual solder pads, eliminating effects of the solder properties, still showed variations in cycling amplitude to systematically reduce subsequent acceleration factors for solder pad cratering. General trends, anticipated consequences and remaining research needs are discussed
, M. Anselm; Universal Instruments Corporation .
