New SMT Equipment: insufficient wetting (12)

MPM® Edison Next Generation Scalable SMT Printer

MPM® Edison Next Generation Scalable SMT Printer

New Equipment | Printing

Unparalleled throughput and accuracy in an advanced next generation scalable printer platform. The MPM Edison™ stencil printer is ideally suited for the growing Automotive and Smart Device manufacturing markets.  The Edison printer i

ITW EAE

TR7700Q - High Accuracy 3D AOI

TR7700Q - High Accuracy 3D AOI

New Equipment | Inspection

The TR7700Q 3D AOI combines the latest of 2D and 3D technologies based on digital quad fringe pattern projection to revolutionize PCB assembly inspection. The versatile programmable 3D digital fringe pattern technology covers a huge inspection range

TRI - Test Research, Inc. USA

Electronics Forum: insufficient wetting (83)

QFP wetting

Electronics Forum | Mon Nov 12 01:18:29 EST 2007 | sin4d

Hi, ALL I experience some QFP with wetting issue on the heel of the lead. There is no fillet wetting on the heel which causes reject bt the customer, but not all the QFP. Could anyone pls help what is the causes of this problem, it is due to oxidati

BGA non wetting

Electronics Forum | Tue Sep 14 21:03:42 EDT 2010 | genesan

Hi Sir, The diameter of the aperature is 17mil and thickness 6mil and since we are using Solder Paste Inspection i believe that should have a good paste deposit on this pad.Let say if no good paste it will more create insufficient solder which X-RAY

Industry News: insufficient wetting (22)

What is the working principle of I.C.T Lyra Reflow Oven

Industry News | 2022-11-11 07:33:41.0

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.

Dongguan Intercontinental Technology Co., Ltd.

SEHO to Debut AOI Feature for the Selective Soldering Process at the 2012 IPC APEX Expo

Industry News | 2012-01-20 15:02:15.0

SEHO Systems GmbH will highlight the new AOI function for its best-selling selective soldering system – the PowerSelective - in Booth #3521 at the upcoming IPC APEX Expo.

SEHO Systems GmbH

Technical Library: insufficient wetting (3)

Humitector™ Type 2 Non-Reversible Humidity Indicator Cards from Clariant help assure the integrity of moisture-sensitive surface-mount devices

Technical Library | 2021-02-20 00:55:47.0

Customers must be able to rely on accurate humidity indication as an assurance of SMD quality and fitness for processing and use. Without it, they might accept SMDs from suppliers that have already been irreparably damaged by moisture during storage or transit. Or, they might approve for processing SMDs that have been improperly or insufficiently heat-dried. Beyond the processing questions, there are financial questions: Where did the dry pack problems originate and who--supplier, customer, shipper--is financially responsible for the damaged SMDs? In response, Clariant, the originator of the color change humidity indicator card, and a member of the JEDEC's Subcommittee 14.1, "Reliability and Test Methods for Packaged Devices," created a new "non-reversible" halogen and cobalt dichloride free humidity indicator card. This HIC combines two reversible indicators (5% and 10%) with a new non-reversible (60% RH) indicator spot. (Figure 1) The 5% and 10% reversible spots work the way similar indicators do: they change color from blue (dry), to lavender, to pink (wet) to indicate humidity exposure at the indicated levels. If humidity levels drop, they will gradually revert back to blue.

Clariant Cargo & Device Protection

Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling

Technical Library | 2016-11-30 21:30:50.0

Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.

Henkel Electronic Materials

Videos: insufficient wetting (3)

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

Top Side Clamping

Top Side Clamping

Videos

High Value Stencil Screen Printing Solutions from JUKI. The PMAXII printers utilize a patented mathematical calculating algorithm to ensure the machine's high accuracy print alignment that easily achieves 01005 (0402 metric) printing. Vision

Southwest Systems Technology

Career Center - Jobs: insufficient wetting (2)

Senior Assembler

Career Center | Oldsmar, Florida USA | Maintenance,Production

Job Description: • Uses microscope to verify correct part placement and orientation, manually align parts before soldering and perform post re-flow inspection and touch-up. • Able to identify and touch up poor wetted solder joints, solder voids / i

intiGrow

Assembler 2 – IPC 610 – 1st Shift

Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production

Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify

Lockheed Martin Corporation

Career Center - Resumes: insufficient wetting (2)

my cv

Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing

AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001

my cv

Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control

AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS

Express Newsletter: insufficient wetting (88)

Partner Websites: insufficient wetting (22)

Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print

: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wettingInsufficient amount of solder due to improper printing parameters

5 Common Solder Mistakes and How to Resolve Them

| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them

: What causes insufficient wetting in soldering? A: Insufficient wetting refers to solder that doesn’t spread evenly across the surface of the joint or


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