SOS Inventory Software provides top-of-the-line inventory control, order management, and manufacturing for a wide variety of industries, plus integration with QBO, UPS, ShipStation, Shopify, BigCommerce, Zapier and PayPal.
Industry Directory | Manufacturer
Heller Thermal Systems India location featuring reflow soldering ovens and pressure curing ovens.
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Tue Aug 01 09:56:22 EDT 2023 | boyabandaoti
Semiconductor is the material to make various electronic devices; The integrated circuit is the electronic device, that is, a certain process is used to make the crystal tube, resistance, capacitance and inductance in a circuit and the connection of
Electronics Forum | Wed Aug 09 09:43:31 EDT 2023 | boyabandaoti
Semiconductor is the material to make various electronic devices; The integrated circuit is the electronic device, that is, a certain process is used to make the crystal tube, resistance, capacitance and inductance in a circuit and the connection of
Used SMT Equipment | AOI / Automated Optical Inspection
2014 Mirtec MV-7 Omni In-line AOI Machine Make: Mirtec Model: MV-7 Vintage: 2014 Description: In-line AOI Details: Five Camera 2D/3D In-Line AOI SystemExclusive FIFTEEN MEGA PIXEL ISIS® Vision SystemAdvanced Six Phase Color Lighting Technology10 Micr
Used SMT Equipment | SMT Equipment
Model No：KS-6004-S Portable conveyor Cycle time：Approx 15seconds Power supply：100-230V AC (customized), single phase Power load：Max 150V/A Air pressure： 4-6 bar Air volume：MAX 10L/minute Transport height：900±20mm (or customized) Transport di
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Model NO. : GW-UL250L , GW- UL330L ,GW- UL390L ,GW- UL460L PCB size(L×W)~(L×W) :(50×50)~(350×250),(50×50)~(455×330),(50×50)~(530×390),(50×50)~(530×460), Machine size (L×W×H) : 1370×750×1200 , 15
Parts & Supplies | AOI / Automated Optical Inspection
Kohyoung integrated calibration target（refernce&multiheight &gray） used Kohyoung integrated calibration tool
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | Charlotte, North Carolina USA | Accounting/Finance
Financial Analyst (Integration Consultant) Will be responsible for developing and documenting a systematic approach for new acquisitions to be integrated into Financial Shared Services. Must understand the capabilities and processes within the FSS
Career Center | Post Falls, Idaho USA | Sales/Marketing
SMT stencil manufacturer looking for manufacturing representatives. Position requires knowledge of, and experience selling, SMT equipment and complimentarty products. For more information, contact the Director of Sales at (208) 262-7200
Career Center | Titusville, Florida USA | Human Resources
Interview scheduling via Leo/Zoom, onsite, travel, onboard integration to include directors, HR staffing and interns, Welcome First Day communications, Sterling BGI support, Prehire Covid tracking, I9 administration, college team surge support, Y1X
Career Center | Cabuyao,, Laguna Philippines | Engineering,Maintenance,Production,Technical Support
�X 10 years experience in SMT field of manufacturing company,knowledge in GC-Powerplace software. �X Knowledge in programming and operating Modular/Turret Machine in Surface Mount Technology and Flipchip technology. �X Expertise in the field of SMT m
