SMB Co. is one of the leading exhibitions and conferences organizers in Egypt. We organize exhibitions in Egypt and represent trade fairs centers in many countries, we have a vast experience and well established connections.
J.D. Edwards is the leading provider of agile, collaborative solutions for the connected economy.
High Speed Cable Assemblies and InterConnect Solution from top manufacturer like Cinch and Positronic Industries etc. at very Effective prices.
ecHUB automates inter-company business processes, helping companies to optimize their supply-chain. Only a small initial investment is required to realize an ROI in a short time frame. Typically, participants go live in about forty-five (45) days. Th
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Tue Feb 21 11:59:56 EST 2006 | dannyleach
We design a broad range of DC/DC power supplies for various telecom, internet, and computor applications and have been succesfully using intrusive reflow for ~7 years now. Our pcbs range from 0.065 to 0.090 in thickness and are moslty dense 4 to 8 la
Used SMT Equipment | In-Circuit Testers
Agilent M9502A AXIe 2-Slot Chassis The Agilent-Hp M9502A AXIe Chassis is fully compatible with the AXIe 1.0 specification. It includes an embedded system module (ESM) that does not take up an instrument slot. This system module performs the cha
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz CMW500 loaded with options Wideband Radio Communication Tester Rohde & Schwarz CMW500 LTE FDD CDMA2000 1XEV-DO with the following configuration: CMW500 Hardware Options Included: H051F/H052F/H054B/H055H/H090A/H100A/H110A/H200
Industry News | 2017-01-24 18:45:22.0
The SMTA Capital Chapter is pleased to announce its first meeting of 2017 on February 23rd, scheduled from 5:00 pm to 8:00 pm at The Test Connection, 11400 Cronridge Drive, Suite H, Owings Mills, MD, 21117. The focus of this chapter meeting will be “Flying Probe in Modern Day” presented by Joe Folsom and Tim Dykes, The Test Connection, featuring a demo and tour of the facility.
Industry News | 2013-05-06 18:48:35.0
IPC – Association Connecting Electronics Industries® announces an ambitious technical agenda for the IPC/FED Conference on Embedded Components.
Parts & Supplies | Pick and Place/Feeders
Yamaha feeder: CL 8*2mm Feeders for 0201 KW1-M1500-030 , CL 8*2mm Feeders for 0402 KW1-M1400-00X ,8*4mmFeeders KW1-M1100-000 YamahaCL 12mm Feeders KW1-M2200-300,CL 16mmFeeders KW1-M3200-10X Yamaha CL 24mm Feeders KW1-M4500-015,CL 32mmFeed
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Parts & Supplies | Pick and Place/Feeders
9965-000-10928 KGB-M712S-A0X shaft for YV100XGP we supply Yamaha machines and spare parts for long time,like feeders,nozzles,drivers,servo motors, boards etc Our product lists are as follow: Yamaha feeder: CL 8*2mm Feeders for 0201 KW1-M
Technical Library | 2016-10-27 16:24:23.0
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassemblies are connected through press-fit connectors. The Press-Fit Compliant Pin is a proven interconnect termination to reliably provide electrical and mechanical connections from a Printed Circuit Board to an Electrical Connector. Electrical Connectors are then interconnected together providing board to board electrical and mechanical inter-connection. Press-Fit Compliant Pins are housed within Connectors and used on Backplanes, Mid-planes and Daughter Card Printed Circuit Board Assemblies. High reliability OEM (Original Equipment Manufacturer) computer designs continue to use press-fit connections to overcome challenges associated with soldering, rework, thermal cycles, installation and repair. This paper investigates the technical roadmap for press fit technology, putting special attention to main characteristics such, placement and insertion, inspection, repair, pin design trends, challenges and solutions. Critical process control parameters within an assembly manufacturing are highlighted.
03003268S01 Dual Holder for Vacuum Generator 03003277S01 ROCKER COMPL. / X8 03003342-03 WASTE CONTAINER COMPL. /COM.CARRIAGE 03003425-02 FILTER UNIT 03003426S04 COMPONENT-CAMERA C+P(TYPE23)6x6 dig. 03003432S02 Protect. Shield, bottom 03003448-
Events Calendar | Wed Aug 16 00:00:00 EDT 2017 - Sat Aug 19 00:00:00 EDT 2017 | Harbin, China
ICEPT 2017, The 18th International Conference on Electronic Packaging Technology
Events Calendar | Mon Jul 10 00:00:00 EDT 2017 - Wed Jul 12 00:00:00 EDT 2017 | Cambridge, United Kingdom
High Temperature Electronics Network (HiTEN) 2015
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | Chennai, India | Sales/Marketing
Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali
SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
SMTnet Express, March 15, 2018, Subscribers: 31,317, Companies: 10,908, Users: 24,499 SMT Stencil, Surface Performance Returning to Basics in the SMT Screen Printing Process to Significantly Improve the Paste Deposition Jim Villalvazo; Inter
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FPC-Pump-Interface-User-Guide-22890001.pdf
numbers 22293199, 22293213, 22193001, 22193002, or 22193003): a. Disconnect the FPC Pump Interface sensor from the P1 (or P2) receptacle in the inter- connect panel. b. Plug the FPC Sensor Simulator dongle (plug) into the now open P1 (or P2) receptacle. c
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track and monitor your business’s assets and staff. These solutions also include: Custom embedded system development Android firmware Product prototyping Hardware manufacturing Device management SDK development Inter-device data exchange protocol
