Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
IPC is the trade association for the printed wiring board and electronics assembly industries.
Industry Directory | Consultant / Service Provider / Manufacturer
PCB designing, PCB Manufacturing ,Reverse Engineering, Product Designing, Product Manufacturing ,Speed delivery of sample PCB
New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
New Equipment | Education/Training
Learn to identify (with the use of aids, visuals or actual components) packaging types of the most commonly used through-hole and surface mount components, interconnections and hardware used in electronic assembly. This course also covers color code
Electronics Forum | Fri Jul 19 13:33:25 EDT 2002 | gdstanton
Dave, fyi...we decided not to go with the interconnects. At least during development phase due to excessive NRE to support the effort. However, we may revisit this when we come to production phase. Gregster
Electronics Forum | Sun Nov 24 22:09:13 EST 2019 | fadzril
Does anyone have experience of mounting MID ( molded interconnect device )? What items are required to be prepared? Can I use my current printer, mounter or reflow ovens?
Used SMT Equipment | X-Ray Inspection
220X magnification provides excellent viewing of the smallest SMD electrical interconnections. Easy-to-use >220X magnification Excellent imaging quality Flexible board/part handling Multipurpose inspection tool Portable, small 32”x
Used SMT Equipment | Board Cleaners
Angle Adjust Input Conveyor Hurricane Jet Performance Package Convenience Package Gas Heat Option Includes (heater, transfer pump, and interconnect) Resys ARS212 Recycle System Upgraded Pumps and Blowers Auc
Industry News | 2013-06-10 17:08:51.0
GPD Global will exhibit in Stand #6275 in the North Hall at the 2013 SEMICON West exhibition & conference. Representatives from GPD Global will exhibit the company's new technology related to fine line and nano-shot dispensing, particularly related to vertical interconnect technology.
Industry News | 2003-06-26 08:12:04.0
He replaces Robert J. Schutz
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Parts & Supplies | Pick and Place/Feeders
5322 320 11235 HARNESS 2-4 (Y-FLEX) 2,277.99 Service Parts - New 5322 320 11239 HARNESS 3-2 (Z-ORG) 1,228.91 Service Parts - New 5322 320 11244 HARNESS 2-10 751.76 Service Parts - New 5322 320 11374 HARNES
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Parts & Supplies | Pick and Place/Feeders
5322 290 60799 AIR SUPPLY COUPLING 265.89 Service Parts - New 5322 290 60838 SET-UP AUX CONTACT 340.96 Service Parts - New 5322 290 81508 CONTACT ELEMENT 105.27 Service Parts - New 5322 310 10689 FILTER, B
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.
The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Peoria,
Ultra High Density Interconnect Conference
Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Career Center | Cleveland, Ohio | Management,Production,Sales/Marketing
Responsible for the creation and production of web content for electronics interconnect industry-based web site. Coordinates the production of content from concept to broadcast. Writes and edits site content. Technically produces and directs live,
Career Center | Independence, Ohio USA | Sales/Marketing
Solder.com is a new B2B exchange for the electronics interconnect and assembly industry. We are looking for an experienced sales representative to sell memberships and associated services to suppliers in the electronics manufacturing industry. This
Career Center | Danville, California | Sales/Marketing
Robert Riemer 129 Wilshire Ct. Danville, CA. 94526 (925) 820-6545 Home (925) 820-6546 Fax (925) 548-9633 Cell briemer@pacbell.net OBJECTIVE Seeking a challenging sales position with a dynamic company pursuing rapid, consistent growth in the electro
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/3d-packaging-and-wafer-level-packaging
& Wafer-Level Packaging Dispensing applications for stacked dies with through silicon vias (TSV) and face-to-face stacked dies 3D packages are emerging in the semiconductor packaging industry to address the serious technical challenges such as miniaturization, faster interconnections, power
| https://www.eptac.com/soldertip/soldertip-41-j-std-001-revision-e-is-here-order-it-now/
. This revision includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and verification for producing quality soldered interconnections and assemblies
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