Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
Quote and lead time Formosa SOLDER,PASTE,SN96.5/AG3/CU.5,89%,20/38um.
Industry Directory | Manufacturer
Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
Sn/3.5Ag, Sn/0.7Cu, Sn/3.9Ag/0.6Cu, Sn/2.0Ag/0.7Cu (for Bar, Wire, Paste, BGA & Anode); Sn/Sb (for Bar); Sn (for Bar, Wire & Anode); Ni/Pd (for Bar, BGA & Anode); Conductive Adhesive (for Paste).
New Equipment | Solder Materials
High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch
Electronics Forum | Fri Jan 29 12:04:13 EST 2010 | davef
In response: * We know of no "videos about Pb-Cu intermetallic." Intermetallics are usually observed in microsections of solder connections. * We are unaware of "Pb-Cu intermetallic." In most soldering results in a copper-tin intermetallic. * Trainin
Electronics Forum | Thu Jan 28 20:22:24 EST 2010 | rbortoli
Hi my name is Renato and I am from Brazil, and I would like to know where I can find some videos about Pb-Cu intermetallic and rework in SMT.
Used SMT Equipment | Soldering - Wave
Electrovert Econopak Plus Lead Free Wave Solder; Model: EPK+ 400/F; SN: MO940811001; Date: 10/1994; 440VAC 3-Phase 32.9 KVA; Full of Indium Sn95.5Ag3.8Cu7 Lead Free Solder; Chip & Lambda Wave; (2) Bottom Side I/R Preheaters; (1) Topside I/R Preheater
Used SMT Equipment | Soldering - Wave
The following Ersa N-Wave 330 has 2 full solder pots and various spares. It is included in the Manroland Online Auction scheduled for August 27-28 on www.xlineassets.com. This system will be sold to the highest bidder and is current just decommission
Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2013-11-01 16:09:44.0
Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.
Parts & Supplies | SMT Equipment
SMT SPARE PARTS SIEMENS PARTS 00335581 CUTTER SET SELECTED TO MACHINE Specifications: Brand Name SIEMENS CUTTER SET SELECTED Part number 00335581 Model Ensure Tested Guarantee 1 month usage for machine SIEMENS ASM Sell & Buy Smt machine
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: Panasonic Part Name: Fixed Blade Part Number: X01A51055H1 Machine: RHS2B Material: Black Mirror Steel Condition: New Stocks X01A51055H1 RH Seires AI Spare Parts RHS2B Fixed Blade For Panasonic Auto Insert Machi
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2014-07-02 16:46:09.0
Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Product name: Halogen Free Lead Free Solder Wire Product code: E9650-HF961 Alloy composition: Sn/Ag3.0/Cu0.5 Diameter: 0.2mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm Packing: 500g/reel, 1kg/reel (10kg/box) Price: Contact us for best price Features:
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, June 20, 2019, Subscribers: 32,068, Companies: 10,815, Users: 24,854 Dissolution in Service of the Copper Substrate of Solder Joints Credits: Nihon Superior Co., Ltd. It is well known that during service the layer of Cu6Sn5
SMTnet Express February 28, 2013, Subscribers: 26214, Members: Companies: 13305, Users: 34373 Effect of Cooling Rate on the Intermetallic Layer in Solder Joints While it has long been known that the Cu6Sn5 intermetallic that plays a critical role
Heller Industries Inc. | https://hellerindustries.com/parts/594882/
594882 - .11NIDEC MTR,5",MK3.5N2,FAN SN - Use SVC PN 594905 Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
| https://www.eptac.com/wp-content/uploads/2012/10/eptac_11_14_12.pdf
.png)
winsouce.jpg)
