Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD,PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
Inline 3D PCB Automated X-ray Inspection System - Advanced Quality Assurance Solution ❙ Introduce of SMT PCBA X-ray Machine Explore our Inline 3D PCB Automated X-ray Inspection System, a cutting-edge solution for advanced quality assurance in PCB
Off-line 3D SMT X-ray Inspection Machine - High-precision Quality Control ❙ Introduce of SMT PCBA X-ray Machine Looking for an off-line 3D SMT X-ray inspection machine? Our high-precision 3D SMT X-ray machine ensures top-notch quality control for
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Sat Oct 15 01:47:09 EDT 2022 | auriga2001
I might need some help to explain what I'm seeing here. The first 3 look like before pictures. They seem ok. The last 3 look like after pictures. It doesn't look like fracturing joints as would be a normal failure for vibration test, more like it rea
Industry News | 2013-09-12 14:29:04.0
STI Electronics, Inc. announces that it will exhibit in Booth #301 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2018-03-11 11:38:15.0
Flextron Circuit Assembly has added 3D Solder Paste Inspection (SPI) capability and Automated Optical Inspection (AOI) to its PCBA manufacturing lines, ensuring high quality and reliability in its finished electronic assemblies.
We can provide professional SMT one line sulotion include SMT loader, Solder paste printer , reflow oven, AOI and so on. E-mail: tina@gdmoje.com Web: www.moje.en.alibaba.com
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SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
SMTnet Express, October 24, 2019, Subscribers: 32,268, Companies: 10,908, Users: 25,250 Investigation of PCB Failure after SMT Manufacturing Process Credits: ACI Technologies, Inc. An ACI Technologies customer inquired regarding PCB failures
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
provided after the webinar All webinar times shown are UK time – to check your local time in your countries click here Registrations are being taken through the SMTA Online Registration System. Webinar: Europe Chapter: Systematic Failure Analysis Webinar