Industry Directory: internal bga failure after vibe (2)

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

SMT Dry Cabinets by Eureka Dry Tech

Industry Directory | Consultant / Service Provider / Manufacturer

Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD,PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.

New SMT Equipment: internal bga failure after vibe (89)

Inline 3D PCB Automated X-ray Inspection System - Advanced Quality Assurance Solution

Inline 3D PCB Automated X-ray Inspection System - Advanced Quality Assurance Solution

New Equipment | Inspection

Inline 3D PCB Automated X-ray Inspection System - Advanced Quality Assurance Solution ❙ Introduce of SMT PCBA X-ray Machine Explore our Inline 3D PCB Automated X-ray Inspection System, a cutting-edge solution for advanced quality assurance in PCB

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Off-line 3D SMT X-ray Inspection Machine - High-precision Quality Control

Off-line 3D SMT X-ray Inspection Machine - High-precision Quality Control

New Equipment | Inspection

Off-line 3D SMT X-ray Inspection Machine - High-precision Quality Control ❙ Introduce of SMT PCBA X-ray Machine Looking for an off-line 3D SMT X-ray inspection machine? Our high-precision 3D SMT X-ray machine ensures top-notch quality control for

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Electronics Forum: internal bga failure after vibe (10)

Dye Penetration test for area array package failure analysis

Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef

First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis

BGA 3D inspection feedback

Electronics Forum | Sat Oct 15 01:47:09 EDT 2022 | auriga2001

I might need some help to explain what I'm seeing here. The first 3 look like before pictures. They seem ok. The last 3 look like after pictures. It doesn't look like fracturing joints as would be a normal failure for vibration test, more like it rea

Industry News: internal bga failure after vibe (3)

Meet with the One-Stop Source for Engineering, Training and Distribution Services at SMTA International

Industry News | 2013-09-12 14:29:04.0

STI Electronics, Inc. announces that it will exhibit in Booth #301 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

STI Electronics

Flextron Ensures Quality with Advanced 3D SPI, AOI Inspection

Industry News | 2018-03-11 11:38:15.0

Flextron Circuit Assembly has added 3D Solder Paste Inspection (SPI) capability and Automated Optical Inspection (AOI) to its PCBA manufacturing lines, ensuring high quality and reliability in its finished electronic assemblies.

FLEXTRON CIRCUIT ASSEMBLY

Videos: internal bga failure after vibe (1)

M606 China High speed LED pick and place machine smt chip mounter with feeder

M606 China High speed LED pick and place machine smt chip mounter with feeder

Videos

We can provide professional SMT one line sulotion include SMT loader, Solder paste printer , reflow oven, AOI and so on. E-mail: tina@gdmoje.com Web: www.moje.en.alibaba.com

Guangdong Moje intelligent Equipment Co,.LTD.

Career Center - Resumes: internal bga failure after vibe (1)

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

Express Newsletter: internal bga failure after vibe (1027)

SMTnet Express - October 24, 2019

SMTnet Express, October 24, 2019, Subscribers: 32,268, Companies: 10,908, Users: 25,250 Investigation of PCB Failure after SMT Manufacturing Process Credits: ACI Technologies, Inc. An ACI Technologies customer inquired regarding PCB failures

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

Partner Websites: internal bga failure after vibe (6)


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2024 Eptac IPC Certification Training Schedule

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SMT feeders

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